Low-melting-point metal powder as well as preparation method and application thereof

Abstract

The invention discloses low-melting-point metal powder as well as a preparation method and application thereof. The preparation method comprises the following steps that after low-melting-point metaland a dispersing agent are heated and melted under an oxygen-free condition, ultrasonic oscillation is conducted to obtain a mixed solution, ultrasonic atomization treatment is conducted on the mixedsolution, and quenching is conducted and then the low-melting-point metal powder is obtained; the prepared low-melting-point metal powder can be applied to silk-screen printing, 3D printing and low-melting-point metal electronic pulped raw materials. The metal powder prepared by the preparation method is fine in particle size, good in sphericity, low in cost and prone to popularize the industrialproduction; the metal powder prepared by the preparation method is suitable for traditional printing methods such as the silk-screen printing, can be widely applied to the fields of novel printing ofthe 3D printing, can be widely applied to the fields of preparation of various low-melting-point metal electronic pulped raw materials, the field of phase change materials and even the field of biological medical treatment, so that the application range of the low-melting-point metal is greatly expanded, and the industrial value of the metal powder and the application is remarkable.

Description

technical field [0001] The invention belongs to the technical field of metal material processing, and in particular relates to a low-melting point metal powder and its preparation method and application. Background technique [0002] The feature that distinguishes low-melting point metals from other metals is that they can melt at lower temperatures and maintain a liquid state even at room temperature. Therefore, the industry also calls them "liquid metals"; Changes are more sensitive than ordinary metal materials, so they have been widely used in engineering fields, especially in phase change energy storage, electronic devices, brazing and processing and manufacturing industries. [0003] In recent years, with the continuous deepening of research on low-melting point metals, their applications have been more popularized in various fields, such as: used in the field of processing and manufacturing, especially bismuth-based alloys, which have an ideal expansion rate close to ...

AI Technical Summary

Problems solved by technology

[0006] However, in the development of the above technologies, most of the focus is on medium and high temperature melting point metals, and rarely involves the field of low melting point metals.

Recently, with the rapid development of low melting point metals represented by gallium indium and bismuth indium tin alloys, low melting point metals have attracted more and more attention, such as 3D printing, printed electronics, conductive paste and phase change materials; however, currently There are still many factors restricting the development of low-melting point metals in terms of application. For example, 3D printing, although it can prepare wires for printing, but because the low-melting point metals themselves are not hard enough, the prepared wires cannot be printed well for a long time. Putting powder as raw material into printed electronics, conductive paste, phase change materials and even 3D printing will greatly expand its application

[0007] At present, although there are methods for the preparation of low-melting-point metal powders, the powder geometry, particle size, and metal oxidation problems cannot meet the requirements of high-performance metal powders in some fields, so high-quality low-melting-point metal powders can be prepared Powder can make it greatly expand industrial applications

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