Packaging base material with good thermal expansion performance

A packaging base and thermal expansion technology, applied to electrical components, circuits, layered products, etc., can solve problems such as poor thermal expansion performance, board warping, and wrinkles

Active Publication Date: 2019-11-22
GUANGDONG HINNO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a packaging base material with good thermal expansion performance, which solves the problem that the packaging base material will inevitably produce wrinkles or boards after long-term use and under high temperature conditions. The problem of warping, the problem of poor thermal expansion performance

Method used

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  • Packaging base material with good thermal expansion performance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] S1, 10 parts of fluorinating agent, 10 parts of aluminum foil, 20 parts of silicate, 15 parts of polyester fiber layer, 7 parts of iron oxide, 8 parts of zirconium dioxide, 11 parts of ceramic powder, 12 parts of lithium petalite and 10 parts The raw materials of zinc oxide were put into a high-speed stirring tank and stirred evenly. After stirring for 1 hour, the batch material was prepared. The batch material was heated to 300°C at a heating rate of 3°C / min and pre-fired for 1 hour, so that the decomposable raw materials were fully decomposed. After obtaining the batch material after pre-burning, continue to heat up to 500 ° C at a heating rate of 5 ° C / min, then add 15 parts of lithium carbonate, 20 parts of zinc carbonate, 10 parts of sodium oxide and 12 parts of talcum powder in the batch material, and add 10 parts of deionized water and 10 parts of ethanol, continue stirring for 1h to obtain the mixture;

[0027] S2. Pour the mixture obtained in S1 into a mold w...

Embodiment 2

[0030] S1, 11 parts of fluorinating agent, 11 parts of aluminum foil, 21 parts of silicate, 17 parts of polyester fiber layer, 8 parts of iron oxide, 9 parts of zirconium dioxide, 13 parts of ceramic powder, 14 parts of lithium feldspar and 11 parts Put the raw materials of zinc oxide into the high-speed stirring tank and mix evenly. After stirring for 1.5 hours, the batch material is prepared. The batch material is heated at a heating rate of 8 °C / min to 320 °C for 2 hours, so that the decomposable raw materials are fully decomposed. After obtaining the batch material after pre-burning, continue to heat up to 550 ° C with a heating rate of 10 ° C / min, add 16 parts of lithium carbonate, 21 parts of zinc carbonate, 11 parts of sodium oxide and 13 parts of talcum powder in the batch material, and at the same time Add 15 parts of deionized water and 11 parts of ethanol, and continue stirring for 1.5h to obtain the mixture;

[0031] S2. Pour the mixture obtained in S1 into a mol...

Embodiment 3

[0034] S1, 12 parts of fluorinating agent, 12 parts of aluminum foil, 22 parts of silicate, 18 parts of polyester fiber layer, 9 parts of iron oxide, 10 parts of zirconium dioxide, 15 parts of ceramic powder, 15 parts of lithium feldspar and 12 parts The raw materials of zinc oxide were put into a high-speed stirring tank and stirred evenly. After stirring for 2 hours, the batch material was prepared. The batch material was heated at a heating rate of 10°C / min to 350°C for 3 hours, so that the decomposable raw materials were fully decomposed. After obtaining the batch material after pre-burning, continue to heat up to 600 ° C at a heating rate of 20 ° C / min, and then add 18 parts of lithium carbonate, 22 parts of zinc carbonate, 12 parts of sodium oxide and 15 parts of talcum powder to the batch material, and add 15 parts of deionized water and 12 parts of ethanol, continue to stir to obtain mixture after 2h;

[0035] S2. Pour the mixture obtained in S1 into a mold with a pr...

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Abstract

The invention discloses a packaging base material with good thermal expansion performance. Raw materials of the base material comprise the following components in parts by weight: 20-30 parts of deionized water, 7-10 parts of graphene nanosheets, 10-12 parts of ethyl alcohol, 10-12 parts of a fluorinating agent, 7-9 parts of acrylic emulsion, 10-12 parts of aluminum foil, 20-22 parts of silicate,15-18 parts of a polyester fiber layer, 7-9 parts of ferric oxide, 8-10 parts of zirconium dioxide and 11-15 parts of ceramic powder. The invention relates to the technical field of packaging base materials. According to the disclosed base material, zinc oxide, petalite, zinc oxide, lithium carbonate, zinc carbonate and sodium oxide are added in a preparation process of the packaging base material, the anti-swelling performance of the packaging base material can be improved; the problem of wrinkles or warping of the packaging base material in the using process can be effectively reduced or eliminated, a packaging film prepared from the graphene nanosheets and the acrylic emulsion as main materials can effectively play a role in heat insulation and protection, and good conditions are created for subsequent normal use of the packaging base material.

Description

technical field [0001] The invention relates to the technical field of packaging substrates, in particular to a packaging substrate with good thermal expansion performance. Background technique [0002] The so-called "packaging technology" is a technology of packaging integrated circuits with insulating plastic or ceramic materials. Taking CPU as an example, the actual volume and appearance seen are not the size and appearance of the real CPU core, but the CPU core, etc. For the products after the components are packaged, the packaging technology is necessary and crucial for the chip, because the chip must be isolated from the outside world to prevent the impurities in the air from corroding the chip circuit and causing the electrical performance to decline. On the other hand , the packaged chip is also easier to install and transport, because the quality of the packaging technology also directly affects the performance of the chip itself and the design and manufacture of th...

Claims

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Application Information

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IPC IPC(8): H01L23/29C08L33/04C08K3/04C08J5/18B32B27/36B32B27/18B32B15/20B32B9/00B32B9/04B32B27/30B32B7/12B32B33/00
CPCB32B7/12B32B9/00B32B9/002B32B9/005B32B9/007B32B9/045B32B15/20B32B27/08B32B27/18B32B27/308B32B27/36B32B33/00B32B2307/304C08J5/18C08J2333/04C08K3/042H01L23/295
Inventor 郭永军张新权温文彦黄荣暖余家斌
Owner GUANGDONG HINNO TECH CO LTD
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