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Display panel

A technology for display panels and substrates, which is applied in the manufacture of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problem that the encapsulation layer cannot effectively block water and oxygen, and achieves improved thermal conductivity, water and oxygen barrier performance, and improved heat dissipation. performance, the effect of improving the elastic modulus

Active Publication Date: 2019-11-22
YUNGU GUAN TECH CO LTD
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Problems solved by technology

[0003] In view of this, the embodiment of the present invention provides a display panel to solve the problem that the encapsulation layer in the prior art cannot effectively block water and oxygen and dissipate heat in time

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Embodiment Construction

[0019] As mentioned in the background art, the encapsulation layer in the prior art has the technical problem that it cannot effectively block water and oxygen and dissipate heat in time. The inventor found that the reason for this problem is that the existing encapsulation layer is formed by alternately stacking organic layers and inorganic layers. Common organic layer materials include acrylic, etc. Common inorganic layer materials include silicon oxide, aluminum oxide and Nitrogen oxide etc. The thermal conductivity of the materials used in the organic layer and the inorganic layer is relatively poor, which makes the thermal conductivity of the encapsulation layer poor. When OLED devices work, they generate heat by themselves. Since the encapsulation layer conducts heat ineffectively in a timely manner, the heat is accumulated in the organic light-emitting layer, and the organic light-emitting materials are decomposed by heat, and the display efficiency is attenuated, there...

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Abstract

The invention provides a display panel which is characterized in that the display panel comprises a substrate; wherein the organic light-emitting layer is positioned on one side of the substrate and comprises a plurality of sub-pixels for displaying light emission; and the packaging layer is arranged in the display light-emitting direction of the organic light-emitting layer, and the packaging layer is a diamond-like carbon film doped with metal elements and non-metal elements. The diamond-like carbon film is used as the packaging layer, so that the water-oxygen barrier performance of packaging can be improved, and the heat dissipation performance of the packaging layer can also be improved. The diamond-like carbon film is doped with metal elements and non-metal elements, so that the elasticity modulus of the diamond-like carbon film can be improved, the technical problem that the diamond-like carbon film is hard, crisp and easy to break is solved, and the thermal conductivity and thewater-oxygen barrier property of the diamond-like carbon film can be further improved. The diamond-like carbon film doped with metal elements and non-metal elements is used as a packaging layer, so that the packaging layer has the functions of effectively blocking water and oxygen and dissipating heat in time.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display panel. Background technique [0002] The organic luminescent material in the OLED (Organic Light Emitting Diode, Organic Light Emitting Diode) device is very sensitive to water and oxygen, and the organic luminescent material is easily degraded or oxidized by water and oxygen, thereby affecting the service life of the OLED device. In addition, if the self-heating of the OLED device cannot be dissipated in time, it will also cause the degradation of the organic light-emitting material, which will reduce the display efficiency and affect the service life. The encapsulation layer of the existing OLED device cannot simultaneously effectively block water and oxygen and timely dissipate heat. Therefore, there is a need for a packaging structure that can effectively block external water and oxygen and dissipate heat in time to reduce thermal decomposition caused by d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L27/32
CPCH10K59/10H10K50/841H10K50/87
Inventor 刘娜徐凯刘操朱平
Owner YUNGU GUAN TECH CO LTD
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