Manufacturing method of multilayer double-sided rigid-flex board and multilayer double-sided rigid-flex board

Abstract

The invention discloses a manufacturing method of a multilayer double-sided rigid-flex board, comprising the following steps: (1) manufacturing a double-sided FPC flexible board; (2) manufacturing atleast one group of flexible material layer structures; (3) manufacturing at least two groups of rigid material layer structures; and (4) hot-pressing the at least one group of flexible material layerstructures on the circuit on the upper surface and / or the lower surface of the double-sided FPC flexible board, and hot-pressing at least one group of rigid material layer structures on each of the outermost circuits above and below a base film of the double-sided FPC flexible board to obtain a multilayer double-sided flexible circuit board. The invention further discloses a multilayer double-sided rigid-flex board manufactured by implementing the method. The manufacturing process is simplified, and the manufacturing is more convenient. The manufactured multilayer double-sided rigid-flex boardhas high-frequency characteristic (namely, capable of transmitting high-frequency signals at high speed), and is particularly suitable for novel 5G technological products. The copper ion migration phenomenon between circuits on the circuit board during electrification is well protected and resisted, and safe and normal operation of the circuits is ensured.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a method for manufacturing a multilayer double-sided rigid-flex board and a product thereof. Background technique [0002] At present, from the communication network to the terminal application, the communication frequency is comprehensive and high-frequency, and high-speed and large-capacity applications emerge in endlessly. In recent years, with the transition of wireless networks from 4G to 5G, network frequencies have continued to increase. According to the 5G development roadmap shown in relevant materials, the future communication frequency will be upgraded in two stages. The goal of the first stage is to increase the communication frequency to 6GHz before 2020, and the goal of the second stage is to further increase it to 30-60GHz after 2020. In terms of market applications, the signal frequency of terminal antennas such as smartphones continues to increase, and there are m...

AI Technical Summary

Problems solved by technology

At present, polyimide (PI) is mainly used as the substrate of flexible boards. However, due to the large dielectric constant and loss factor of PI substrates, large moisture absorption, and poor reliability, the PI flexible boards The high-frequency transmission loss is serious and the structural characteristics are poor, which can no longer adapt to the current high-frequency and high-speed trend

Therefore, with the emergence of new 5G technology products, the signal transmission frequency and speed of existing circuit boards have been difficult to meet the requirements of 5G technology products

[0004] At the same time, in the preparation process of traditional multi-layer double-sided rigid-flex boards, there are generally many technological processes, complicated production, and problems such as increased power consumption and signal transmission loss in terms of circuit board performance.

[0005] At the same time, when the precision circuit board is powered on, copper ions will migrate between the lines. During the use of the equipment, the circuit will burn and explode due to conduction and collision, resulting in circuit The wiring on the board is not safe and working properly

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