GaN-based fin field effect transistor device and manufacturing method thereof
A fin-type field effect and manufacturing method technology, applied in the field of electronics, can solve the problems of small space for performance improvement and insufficient linearity, and achieve the effects of improving linearity, reducing electric field intensity, and uniform electric field distribution
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[0044] In order to make the above-mentioned objectives, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0045] The present invention first provides a GaN-based fin field effect transistor device, the structure of which is as figure 1 As shown, it includes a substrate 101, a buffer layer 102, a barrier layer 103, and a passivation layer 104 arranged in sequence, wherein:
[0046] A source 105 is provided on one end of the barrier layer 103, and a drain 106 is provided on the other end;
[0047] The passivation layer 104 is arranged on the barrier layer 103 between the source electrode 105 and the drain electrode 106; an opening is arranged in the middle of the passivation layer 104;
[0048] A plurality of grooves 107 are arranged in the barrier layer 103 region corresponding to the opening; fins 108 are arranged between adj...
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