An apparatus using multiple beams of charged particles

Abstract

Disclosed herein is an apparatus comprising: a first electrically conductive layer; a second electrically conductive layer; a plurality of optics element s between the first electrically conductive layer and the second electrically conductive layer, wherein the plurality of optics elements are configured to influence a plurality of beams of charged particles; a third electrically conductive layerbetween the first electrically conductive layer and the second electrically conductive layer; and an electrically insulating layer physically connected to the optics elements, wherein the electricallyinsulating layer is configured to electrically insulate the optics elements from the first electrically conductive layer, and the second electrically conductive layer.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Application 62 / 492,043, filed April 28, 2017, the entire contents of which are incorporated herein by reference. technical field [0003] The present disclosure relates to an apparatus for inspecting or observing samples, such as wafers and masks, used in device fabrication processes, such as the fabrication of integrated circuits (ICs). Background technique [0004] The device fabrication process may include applying a desired pattern to a substrate. A patterning device (alternatively referred to as a mask or reticle) can be used to generate the desired pattern. The pattern can be transferred onto a target portion (eg, a portion comprising one or several dies) on a substrate (eg, a silicon wafer). The transfer of the pattern is usually via imaging onto a layer of radiation sensitive material (resist) provided on the substrate. A single substrate may contain a network of adjac...

AI Technical Summary

Problems solved by technology

Inspection may also reveal patterning defects (e.g., failed attachment or detachment) and uninvited particles

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