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A hot-melt peelable adhesive

A hot-melt, peeling technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of difficult cleaning of residues, difficult to peel off, low efficiency, etc. Peeling, good flexibility

Active Publication Date: 2021-05-04
亿铖达(深圳)新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Masking paper has good flexibility, but there are problems such as high cost, difficult to peel off, and difficult to clean residues. In addition, manual operation is required and the efficiency is low.

Method used

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  • A hot-melt peelable adhesive

Examples

Experimental program
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Effect test

preparation example Construction

[0053] The second aspect of the present invention provides the preparation method of the above-mentioned hot-melt peelable adhesive, which includes the following steps: adding raw materials according to the above weight parts, heating to 200-280°C and stirring to form a uniform viscous liquid, discharging, cooling and have to.

[0054] The third aspect of the present invention provides the application of the above-mentioned hot-melt peelable adhesive in the shielding protection of components.

[0055] In one embodiment, the components include but are not limited to radiator elements, power resistors, power diodes, cement resistors, adjustable resistors, buzzers, and circular pads.

Embodiment 1

[0059] Example 1 provides a hot-melt peelable adhesive, including the following raw materials in parts by weight: 60 parts of thermoplastic rubber, 30 parts of polyolefin, 23 parts of tackifying resin, 45 parts of plasticizer, and 3 parts of antioxidant.

[0060] The thermoplastic rubber is a mixture of styrene-butadiene-styrene block copolymer and styrene-ethylene-butylene-styrene block copolymer.

[0061] The mass ratio of the styrene-butadiene-styrene block copolymer to the styrene-ethylene-butylene-styrene block copolymer is 1:4.5.

[0062] The model of the styrene-butadiene-styrene block copolymer is SBS-792.

[0063] The model of the styrene-ethylene-butylene-styrene block copolymer is YH-602.

[0064] The polyolefin is polypropylene.

[0065] The polypropylene grade is M800EX.

[0066] The tackifying resin is aromatic hydrocarbon modified terpene resin and petroleum resin.

[0067] The mass ratio of the aromatic modified terpene resin to the petroleum resin is 1:0.1...

Embodiment 2

[0074] Embodiment 2 is basically the same as Embodiment 1, the only difference is: hot-melt peelable adhesive, including the following raw materials in parts by weight: 40 parts of thermoplastic rubber, 20 parts of polyolefin, 15 parts of tackifying resin, 30 parts of plasticizer, Antioxidant 2 parts.

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Abstract

The invention relates to the technical field of shielding protection, in particular to a hot-melt peelable adhesive. A hot-melt peelable adhesive, comprising the following raw materials in parts by weight: 40-80 parts of thermoplastic rubber, 15-30 parts of tackifying resin, 20-40 parts of polyolefin, 30-60 parts of plasticizer, and 2 parts of antioxidant -4 parts. The hot-melt peelable adhesive produced by the invention has no volatile organic compounds, is safe and environmentally friendly; has a fast curing speed, does not require curing equipment, and can be cured without heating or UV conditions; it is solid at room temperature and is easy to transport and store; flexible Good resistance, excellent stretching performance, strong waterproof, easy to peel off, no residual traces and stains; strong boundary; process automation, high production efficiency.

Description

technical field [0001] The invention belongs to the technical field of shielding protection, and more specifically, the invention relates to a hot-melt peelable adhesive. Background technique [0002] With the economic growth and the rapid development of the electronic information industry, the requirements for production efficiency and product quality are becoming more and more stringent. Among them, before the printed circuit board is assembled, it is necessary to shield and protect the components that cannot be coated. At present, most of them still use masking paper or high-temperature tape. Masking paper has good flexibility, but there are problems such as high cost, difficult peeling, and difficult cleaning of residues. In addition, manual operation is required and the efficiency is low. Therefore, facing the current situation of increasingly expensive labor resources and higher integration, it is imminent to develop a hot-melt peelable adhesive that cures quickly, is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J153/02C09J123/12C09J11/08C09J11/06
CPCC08L2201/08C08L2205/02C08L2205/035C09J11/06C09J11/08C09J153/025C08L53/02C08L23/12C08L57/02C08L45/00C08K5/1345
Inventor 石学堂张彩绵
Owner 亿铖达(深圳)新材料有限公司
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