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Detection substrate and preparation method thereof, detection device and detection method

A detection substrate, a technology to be detected, applied in measurement devices, semiconductor/solid-state device testing/measurement, measurement of electricity, etc., and can solve the problem of not guaranteeing the yield of light-emitting elements.

Active Publication Date: 2021-08-20
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The technical problem to be solved by the embodiments of the present invention is to provide a detection substrate and its preparation method, detection device and detection method, so as to overcome the problems that the existing mass detection method cannot guarantee the yield rate of light-emitting elements before mass transfer.

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  • Detection substrate and preparation method thereof, detection device and detection method
  • Detection substrate and preparation method thereof, detection device and detection method
  • Detection substrate and preparation method thereof, detection device and detection method

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Embodiment Construction

[0053] Mass transfer technology is to transfer a large number (usually tens of thousands to hundreds of thousands) of Micro / Mini LEDs to the driver circuit board to form an LED array, while mass detection technology is to detect Micro / Mini LEDs before mass transfer . At present, the existing mass inspection method is only the appearance inspection of the plane and 3D morphology of Micro / Mini LEDs to eliminate Micro / Mini LEDs with cracks and other defects.

[0054]The inventors of the present application found that although the existing mass inspection can eliminate Micro / Mini LEDs with appearance defects, the Micro / Mini LEDs with qualified appearance may still have defects such as failure to light up, so the existing mass inspection method The yield rate of Micro / Mini LED before mass transfer cannot be guaranteed. Due to the low yield rate of Micro / Mini LEDs before mass transfer, it cannot be guaranteed that the Micro / Mini LEDs bonded to the driver circuit board can be lit, s...

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Abstract

Embodiments of the present invention provide a detection substrate, a preparation method thereof, a detection device and a detection method. The detection substrate includes a base, the base includes a plurality of through holes, the through holes are embedded with electrode columns, the base includes a detection area and a pad area, the detection area includes a driving circuit, and the pad area is set There is a pad, and the pad is connected to the electrode column through the driving circuit. By introducing the detection substrate, the present invention realizes lighting detection of light-emitting elements before mass transfer, ensures the yield rate of light-emitting elements before mass transfer, reduces the repair ratio after mass transfer, and effectively overcomes the existing mass transfer. The detection method cannot guarantee the yield rate of the light-emitting elements before mass transfer and other issues.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a detection substrate for mass detection of light-emitting diodes, a preparation method thereof, a detection device and a detection method. Background technique [0002] Light Emitting Diode (LED) technology has been developed for nearly 30 years. It has the characteristics of small size, high brightness and low energy consumption. Broader applications provide a solid foundation. With the development of chip manufacturing and packaging technology, sub-millimeter light-emitting diode (Mini Light Emitting Diode, Mini LED) displays with a size of about 100 microns and micro-light-emitting diodes (Micro Light Emitting Diode, Micro LED) displays with a size of less than 50 microns have gradually become A hotspot of the display panel. Among them, Micro LED display has significant advantages such as low power consumption, high color gamut, ultra-high resolution, and ultra-thin, and i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/544H01L21/66H01L27/15
CPCH01L27/156H01L22/14H01L22/34H01L22/24H01L33/0095G01R31/2635H01L25/0753H01L2224/16235G01R1/07378G01R31/2886H01L33/0093H01L33/36H01L33/52H01L33/62H01L2933/0016H01L2933/005
Inventor 吕志军董立文宋晓欣张锋崔钊刘文渠孟德天王利波
Owner BOE TECH GRP CO LTD