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Cutting forming equipment for high-thermal-conductivity aluminum substrate

A technology for forming equipment and aluminum substrates, applied in metal processing equipment, other manufacturing equipment/tools, manufacturing tools, etc., can solve the problems of no equipment, etc., achieve the effects of reducing workload, improving processing efficiency, and convenient use

Active Publication Date: 2020-01-14
赣州逸豪新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, there is no corresponding equipment for actual operation of this process. Therefore, it is necessary to design a high thermal conductivity aluminum substrate cutting and forming equipment that conforms to the design principle of this process.

Method used

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  • Cutting forming equipment for high-thermal-conductivity aluminum substrate
  • Cutting forming equipment for high-thermal-conductivity aluminum substrate
  • Cutting forming equipment for high-thermal-conductivity aluminum substrate

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Embodiment Construction

[0036] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0037] Wherein, the accompanying drawings are only for illustrative purposes, showing only schematic diagrams, rather than physical drawings, and should not be construed as limitations on this patent; in order to better illustrate the embodiments of the present invention, some parts of the accompanying drawings will be omitted, Enlargement or reduction does not represent the size of the actual product; for those skilled in the art, it is understandable that certain known structures and their descriptions in the drawings may be omitted.

[0038] In the drawings of the embodiments of the present invention, the same or similar symbols correspond to the same or similar components; , "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional ...

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Abstract

The invention relates to the field of aluminum substrate machining, and particularly relates to cutting forming equipment for a high-thermal-conductivity aluminum substrate. The cutting forming equipment comprises a workbench, a clamping assembly, a scale plate, a lifting assembly, a V-shaped cutting assembly, a polishing assembly and an industrial computer, wherein the clamping assembly is fixedly mounted at the top of the workbench, the lifting assembly is vertically and fixedly mounted on one side of the top of the workbench, the scale plate is horizontally mounted on the side, close to theclamping assembly, of the lifting assembly, the V-shaped cutting assembly is horizontally mounted on the lifting assembly, and the polishing assembly is fixedly mounted at the end, away from the scale plate, of the V-shaped cutting assembly; and the V-shaped cutting assembly comprises a cutting tool capable of cutting transversely, the tool point of the cutting tool is provided with a V-shaped opening, the length direction of the cutting tool is consistent with the working direction of the workbench. According to the cutting forming equipment for the aluminum substrate, the whole aluminum substrate is cut off from the transverse position, half-V-cutting is carried out on the two sides, the two sides of a finished product broken off are smooth and flat without burrs, only a few burrs existat the two ends, and deburring treatment is carried out without needing special labor, so that the workload is reduced, and the machining efficiency is improved.

Description

technical field [0001] The invention relates to the field of processing aluminum substrates, in particular to cutting and forming equipment for high thermal conductivity aluminum substrates. Background technique [0002] The aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided panel consists of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. For high-end use, it is also designed as a double-sided board, and the structure is a circuit layer, an insulating layer, an aluminum base, an insulating layer, and a circuit layer. Very few applications are multilayer boards, which can be made by laminating ordinary multilayer boards with insulating layers and aluminum substrates. Aluminum substrates are often used in LED lighting products. There are two sides, the white side is for soldering the LED pins, and the other side shows the natural color of aluminum...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P23/04B23Q3/08B23Q5/40B23D79/00
CPCB23D79/00B23P23/04B23Q3/062B23Q3/08B23Q5/40B23Q2703/04
Inventor 张剑萌崔建华陆峰付赞辉罗诒宪刘磊李铁林彭行皇谢军卢自强肖伟
Owner 赣州逸豪新材料股份有限公司
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