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Transparent backplane for photovoltaic module and preparation method thereof

A technology of photovoltaic modules and transparent substrates, applied in photovoltaic power generation, electrical components, semiconductor devices, etc., can solve the problems of increasing process cost and process difficulty, and achieve the effects of cost control, process easy operation, and pollution reduction

Active Publication Date: 2020-01-14
HANGZHOU FIRST APPLIED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its preparation process through radiation curing increases the process cost and process difficulty

Method used

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  • Transparent backplane for photovoltaic module and preparation method thereof
  • Transparent backplane for photovoltaic module and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] On the outer layer of the double-sided coating type transparent substrate, the casting solution obtained by dissolving 10 parts of polyvinylidene fluoride powder in 100 parts of N,N-dimethylformamide solvent under stirring at 60 ° C, the casting film Add 0.005 parts of fumed silica to the solution, then precipitate and solidify in a water coagulation bath, and then pass through a drying tunnel at 100°C for 3 minutes. A 255 μm thick PET film is selected as the transparent substrate, the thickness of the inner layer of the transparent substrate is 10 μm, the thickness of the outer layer is 2 μm, and the thickness of the coated polyvinylidene fluoride film is 13 μm.

Embodiment 2

[0051] On the outer layer of the double-sided coating type transparent substrate, the casting solution obtained by dissolving 8 parts of polyvinylidene fluoride powder in 100 parts of N,N-dimethylformamide solvent under stirring at room temperature, the casting solution Add 0.01 part of fumed silica, then precipitate and solidify in a coagulation bath of water / ethanol=10 / 1, and then pass through a drying tunnel at 120°C for 3 minutes. A 275 μm thick PET film is selected as the transparent substrate, the thickness of the inner layer of the transparent substrate is 13 μm, the thickness of the outer layer is 3 μm, and the thickness of the coated polyvinylidene fluoride film is 15 μm.

Embodiment 3

[0053] On the outer layer of the double-sided coated transparent substrate, 20 parts of polyvinylidene fluoride powder is dissolved in 100 parts of N,N-dimethylformamide / dimethylsulfoxide=1 / 1 The casting solution obtained from the solvent, 0.5 parts of fumed silica was added to the casting solution, and then precipitated and solidified in a water coagulation bath, and then treated in a 150°C oven for 2 minutes. A 245 μm thick PET film is selected as the transparent substrate, the thickness of the inner layer of the transparent substrate is 5 μm, the thickness of the outer layer is 5 μm, and the thickness of the coated polyvinylidene fluoride film is 8 μm.

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Abstract

The invention discloses a transparent backplane for a photovoltaic module and a preparation method thereof. The transparent backplane successively includes, from the outside to the inside, a hydrophobic modified polyvinylidene fluoride film layer, a first fluorocarbon coating layer, a transparent substrate, and a second fluorocarbon coating layer. The preparation method comprises the following steps: coating the two sides of the transparent substrate with the first fluorocarbon coating layer and the second fluorocarbon coating layer respectively to obtain a double-sided coated transparent substrate; coating the outer layer of the first fluorocarbon coating layer of the double-sided coated transparent substrate a hydrophobic modified polyvinylidene fluoride casting film solution which formsthe hydrophobic modified polyvinylidene fluoride film layer on the outer layer of the double-sided coated transparent substrate by a phase inversion method. The transparent backplane has a simple preparation process, is economical and environment-friendly, has good weather resistance, and can be self-cleaned.

Description

technical field [0001] The invention belongs to the technical field of photovoltaic cell packaging, and in particular relates to a transparent backboard for photovoltaic modules and a preparation method thereof. Background technique [0002] At present, my country's photovoltaic power generation continues to develop rapidly, the technical level is constantly improving, and the industrial system is constantly improving. Especially with the development of high-efficiency technology, the power generation power of photovoltaic modules is getting higher and higher, and the era of industrial parity on the Internet is coming quickly, which is conducive to promoting my country's Development of new energy industry. [0003] The development of high-efficiency technologies such as double-sided modules, half-chip technology, large-block modules, and reduced gap distances fully illustrate the broad prospects of transparent backplanes. As the packaging and protection material for the oute...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/049H01L31/18
CPCH01L31/049H01L31/18Y02P70/50
Inventor 詹志英杨楚峰林建华
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD
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