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Aerogel heat insulation sheet for electronic product and preparation method thereof

An electronic product and aerogel technology, which is applied in the field of airgel heat insulation sheets for electronic products and its preparation, can solve the problems such as the reduction of heat insulation effect of packaged airgel, achieve good heat insulation effect, convenient operation, and reduce The effect of heat insulation effect

Inactive Publication Date: 2020-01-21
GONG YI VAN-RES INNOVATION COMPOSITE MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to prevent the occurrence of airgel powder shedding and the problem of reduced heat insulation effect of airgel packaged in the prior art, the purpose of the present invention is to provide an airgel heat insulation sheet for electronic products and its preparation method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] An aerogel heat insulation sheet for electronic products. The aerogel heat insulation sheet comprises two upper and lower layers of PET felt and a silica aerogel heat insulation layer integrally formed between the layers of PET felt.

[0019] The preparation method, the steps are as follows:

[0020] (1) Disperse silica aerogel powder in a water-based polymer paint to obtain a mixed paint; wherein the water-based polymer paint is a water-based acrylic paint, and the mass percentage of the polymer in the water-based polymer paint accounts for 6% ; The mass ratio of silica aerogel powder and polymer in water-based polymer coating is 80:20, and the sum of the two is 100;

[0021] (2) Add industrial alcohol to the mixed coating at a ratio of 8% of the mass fraction of the mixed coating, stir and mix evenly;

[0022] (3) Place the PET felt on the coating machine, and apply the mixed coating obtained in step (2) to the PET felt by knife coating. After the coating is completed, lay an...

Embodiment 2

[0025] An aerogel heat insulation sheet for electronic products. The aerogel heat insulation sheet comprises two upper and lower PI felts and a silica aerogel heat insulation layer integrally formed between the two PI felts.

[0026] The preparation method, the steps are as follows:

[0027] (1) Disperse silica aerogel powder in a water-based polymer coating to obtain a hybrid coating; wherein the water-based polymer coating is a water-based acrylic polyurethane coating, and the mass percentage of the polymer in the water-based polymer coating is 12 %; The mass ratio of silica aerogel powder and polymer in the water-based polymer coating is 90:10, and the sum of the two is 100;

[0028] (2) Add industrial alcohol to the mixed paint in a proportion of 10% of the mass fraction of the mixed paint, stir and mix evenly;

[0029] (3) Place the PI felt on the coating machine, and apply the mixed coating obtained in step (2) to the PI felt by spraying. After the coating is completed, another ...

Embodiment 3

[0032] An aerogel thermal insulation sheet for electronic products. The aerogel thermal insulation sheet comprises two upper and lower PE felts and a silica aerogel thermal insulation layer integrally formed between the two PE felts.

[0033] The preparation method, the steps are as follows:

[0034] (1) Disperse silica aerogel powder in a water-based polymer coating to obtain a hybrid coating; wherein the water-based polymer coating is a water-based polyurethane coating, and the mass percentage of the polymer in the water-based polymer coating is 15% ; The mass ratio of silica aerogel powder and polymer in water-based polymer coating is 70:30, and the sum of the two is 100;

[0035] (2) Add absolute ethanol to the mixed paint in a proportion of 20% of the mass fraction of the mixed paint, stir and mix evenly;

[0036] (3) Place the PE felt on the coating machine, and apply the mixed coating obtained in step (2) onto the PE felt by roller coating. After the coating is completed, lay a...

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Abstract

The invention belongs to the technical field of heat insulation of electronic products, and discloses an aerogel heat insulation sheet for an electronic product and a preparation method of the aerogelheat insulation sheet. The aerogel heat insulation sheet comprises an upper layer felt body, a lower layer felt body and an aerogel heat insulation layer integrally formed between the two felt bodies. The preparation method comprises the following steps: (1) dispersing aerogel powder into a water-based polymer coating to obtain a mixed coating; (2) adding industrial alcohol or absolute ethyl alcohol accounting for 5-20% of the mass of the mixed coating into the mixed coating, and uniformly stirring and mixing the coating; (3) placing the felt body on a coating machine, coating the felt body with the mixed coating obtained in the step (2), and paving another felt body on the surface of the coating layer after the coating is completed, so as to obtain a composite layer; and (4) carrying outhot press molding on the composite layer obtained in the step (3) on a hot press to obtain the aerogel heat insulation sheet for the electronic product. According to the invention, the felt body is prevented from falling off from the network structure and scattering on the surface of the packaging film when the aerogel is packaged by the felt body, so that the thermal insulation effect of the thermal insulation sheet is greatly reduced.

Description

Technical field [0001] The invention belongs to the technical field of thermal insulation of electronic products, and specifically relates to an aerogel thermal insulation sheet for electronic products and a preparation method thereof. Background technique [0002] With the development of electronic technology, the degree of integration of circuits is getting higher and higher, making it difficult for the heat generated by electronic components to dissipate in time. Today's electronic products have been greatly reduced in size, but power consumption has increased instead. The resulting equipment Overheating has gradually become an important cause of electronic equipment failure. Thermal management solutions for electronic devices are becoming more and more important, and traditional thermal insulation and heat dissipation solutions can no longer be adapted to the increasing social demands. At present, most of the heat transfer of electronic products is generated in the CPU, whic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/02B32B27/12B32B27/36B32B27/28B32B27/32B32B37/10B32B37/06
CPCB32B5/02B32B5/26B32B37/06B32B37/10B32B2262/02B32B2262/0253B32B2262/0284
Inventor 刘喜宗张继承姚栋嘉杨红霞陈帅王红伟张东生吴恒何凤霞董会娜
Owner GONG YI VAN-RES INNOVATION COMPOSITE MATERIAL CO LTD
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