Toughened phenol-formaldehyde foam insulation board and preparation method thereof

A technology of phenolic foam and thermal insulation board, which is applied in the field of building exterior wall materials, can solve the problems of high thermal conductivity of phenolic foam board, high strength and oxygen index of thermal insulation board, low thermal conductivity, etc., and achieve the effect of improving strength, toughness and toughening Significant, solve the effect of brittleness and powder loss

Inactive Publication Date: 2016-10-26
合肥广能新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above problems of high thermal conductivity and poor toughness of phenolic foam boards, the present invention proposes a toughened phenolic foam insulation board, which has high strength and oxygen index and low thermal conductivity

Method used

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  • Toughened phenol-formaldehyde foam insulation board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A toughened phenolic foam insulation board, calculated in parts by weight, comprising the following raw materials:

[0023] 65 parts of phenolic resin, 12 parts of silane coupling agent KH550, 5 parts of silica sol, 4 parts of Tween 80, 7 parts of cyclopentane, 12 parts of p-toluenesulfonic acid and 4 parts of toughening agent. The following components of the toughening agent: 30 parts of acrylic acid styrene copolymer emulsion, 5 parts of polyacrylic acid and 13 parts of modified wollastonite fiber, the modified wollastonite fiber is wollastonite coated with methyl methacrylate.

[0024] The preparation method comprises the following steps:

[0025] 1) Mix phenolic resin, silane coupling agent KH550, silica sol, phosphoric acid and toughening agent uniformly at 70°C to obtain mixture A;

[0026] 2) Mix and stir the mixture A, Tween 80 and cyclopentane evenly, quickly pour it into a mold preheated at 45°C to foam, and then solidify.

Embodiment 2

[0028] A toughened phenolic foam insulation board, calculated in parts by weight, comprising the following raw materials:

[0029] 60 parts of phenolic resin, 10 parts of silane coupling agent KH560, 4 parts of silica sol, 3 parts of Tween 80, 5 parts of n-pentane, 11 parts of hydrochloric acid and 3 parts of toughening agent. The toughening agent includes the following components: 25 parts of acrylic acid styrene copolymer emulsion, 6 parts of polyacrylic acid and 10 parts of modified wollastonite fiber.

[0030] The preparation method comprises the following steps:

[0031] 1) Mix phenolic resin, hydrochloric acid, silane coupling agent KH560, silica sol and toughening agent uniformly at 60°C to obtain mixture A;

[0032] 2) Mix and stir the mixture A, Tween 80 and n-pentane evenly, quickly pour it into a mold preheated at 40°C to foam, and then solidify.

Embodiment 3

[0034] A toughened phenolic foam insulation board, calculated in parts by weight, comprising the following raw materials:

[0035] 68 parts of phenolic resin, 13 parts of silane coupling agent KH560, 6 parts of silica sol, 5 parts of Tween 80, 8 parts of n-pentane, 10 parts of phosphoric acid and 5 parts of toughening agent. The toughening agent is 32 parts of acrylic styrene copolymer emulsion, 3 parts of polyacrylic acid and 14 parts of modified wollastonite fiber.

[0036] The preparation method comprises the following steps:

[0037] 1) Mix phenolic resin, silane coupling agent KH560, silica sol, a mixed acid of phosphoric acid and p-toluenesulfonic acid, and a toughening agent at 62°C to obtain mixture A;

[0038] 2) Mix and stir the mixture A, Tween 80 and n-pentane evenly, quickly pour it into a mold preheated at 42°C to foam, and then solidify.

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Abstract

The invention provides a toughened phenol-formaldehyde foam insulation board and a preparation method thereof. The toughened phenol-formaldehyde foam insulation board contains the following raw materials in parts by weight: 60-70 parts of phenol-formaldehyde resin, 10-15 parts of silane coupling agent, 4-6 parts of silica sol, 3-6 parts of surfactant, 5-10 parts of foamer, 10-15 parts of curing agent and 3-6 parts of toughening agent, wherein the toughening agent is prepared from an acrylic-styrene copolymer emulsion, polyacrylic acid and modified wollastonite fibers. The preparation method comprises the following steps: (1) uniformly mixing the phenol-formaldehyde resin, the silane coupling agent, the silica sol, the curing agent and the toughening agent at the temperature of 60 DEG C to 80 DEG C, so as to obtain a mixture A; (2) uniformly mixing and stirring the mixture A, the surfactant and the foamer, rapidly pouring the mixture into a preheated mold for foaming, and carrying out curing, thereby preparing the toughened phenol-formaldehyde foam insulation board. The insulation board is high in strength and oxygen index and small in coefficient of thermal conductivity.

Description

technical field [0001] The invention belongs to the technical field of building exterior wall materials, and in particular relates to a toughened phenolic foam insulation board and a preparation method thereof. Background technique [0002] Phenolic insulation board and polyurethane rigid foam are both organic thermosetting high-efficiency insulation materials. Especially in recent years, with the gradual improvement of building energy saving rate, the technical performance of applied insulation materials is getting higher and higher, and the market demand is increasing. In the application of thermal insulation materials in building applications, not only high physical and technical performance is required, but also fire protection performance must be achieved. Although the foam produced by phenolic resin and rigid polyurethane foam are relatively good thermal insulation materials, the two types of thermal insulation materials have different advantages and disadvantages, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/06C08L33/02C08K13/06C08K9/10C08K7/10C08K3/36C08J9/14
CPCC08L61/06C08J9/141C08J2203/14C08J2361/06C08J2433/02C08L2201/02C08L2201/08C08L2203/14C08L2205/025C08L2205/03
Inventor 刘涛
Owner 合肥广能新材料科技有限公司
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