Microfluidic device and its preparation method, microfluidic system

Abstract

The invention relates to a microfluidic device, a preparation method thereof, and a microfluidic system. The preparation method includes: providing a shaping mold with a groove; injecting liquid metal into the groove, and solidifying the liquid metal to obtain a solid metal; separating the solid metal from the shaping mold, and setting electrodes on the solid metal; A coating layer is formed on the surface of the solid metal with electrodes, so that the electrodes at least partly protrude from the coating layer to obtain a prefabricated device; the prefabricated device is placed in the substrate solution and the substrate solution is solidified to obtain a microfluidic device; wherein, the substrate solution After solidification to form the substrate, the electrodes protrude at least partially from the substrate, exothermic during the solidification of the substrate solution to melt the solid metal. The preparation method is simple, good in encapsulation, high in device integration, and easy for industrialization. The prepared microfluidic device has good formability, excellent performance, and wide application fields. It can be integrated with a power supply, signal transmitter, and signal receiver to form a microfluidic system. .

Description

technical field [0001] The invention relates to the microfluidic field, in particular to a microfluidic device, a preparation method thereof, and a microfluidic system. Background technique [0002] The traditional preparation methods of microfluidic devices mainly include 3D direct writing / printing technology, microchannel injection technology, embossing technology and laser processing technology. However, 3D direct writing / printing technology cannot achieve good water and oxygen barrier and packaging, and it is easy to form a metal oxide layer on the surface; the microchannel injection process is complicated, and there are many restrictions on patterning and flow channel configuration; imprinting technology The integrated molding of the obtained device is poor; the laser processing technology procedure is complicated, and the adaptability of the processing link is poor. Therefore, the traditional methods for preparing microfluidic devices have their own shortcomings and d...

AI Technical Summary

Problems solved by technology

However, 3D direct writing / printing technology cannot achieve good water and oxygen barrier and packaging, and it is easy to form a metal oxide layer on the surface; the microchannel injection process is complicated, and there are many restrictions on patterning and flow channel configuration; imprinting technology The integrated molding of the obtained device is poor; the laser processing technology program is complicated, and the adaptability of the processing link is poor

Therefore, the traditional methods of preparing microfluidic devices have their own shortcomings and deficiencies, and cannot adapt to the industrial production of large-scale microfluidic devices.

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