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Heat dissipation film and its preparation method, chip component and electronic equipment

A heat-dissipating film and chip technology, used in circuits, electrical components, semiconductor devices, etc., can solve problems such as unfavorable assembly of heat sinks and heat source electronic parts, in-depth research on heat-dissipating films, and lack of heat-dissipating effects. The effect of stable performance and extended service life

Active Publication Date: 2022-03-22
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the heat sink materials commonly used in electronic products include graphite sheet, thermal silica gel, thermal gel, thermal tape and other materials, but the heat dissipation effect is still lacking, and the structure is single, which is not conducive to heat sink and heat source electronic parts ( Such as the assembly of chips), which in turn affects the heat dissipation effect
[0003] Therefore, the research on the heat dissipation film needs to be deepened.

Method used

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  • Heat dissipation film and its preparation method, chip component and electronic equipment
  • Heat dissipation film and its preparation method, chip component and electronic equipment
  • Heat dissipation film and its preparation method, chip component and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] The steps for preparing the heat dissipation film are:

[0063] Coating a graphene oxide dispersion on the surface of the substrate, wherein the mass concentration of graphene oxide in the graphene oxide dispersion is 5.8%;

[0064] The graphene dispersion is evaporated to dryness, so as to obtain the graphene oxide film;

[0065] Place the graphene oxide film in the reducing agent solution for a period of time and then carry out the reduction treatment to obtain the expanded graphene original film, wherein the reducing agent is hydroiodic acid, and the molar concentration of the reducing agent in the reducing agent solution is 0.8mol / L. The temperature of the treatment is 2850°C, the time is 1 hour, and the density of the expanded graphene original film is 0.4g / cm 3 ;

[0066] The original expanded graphene film is placed in a 3D mold for calendering to obtain a graphene film (i.e. a heat dissipation film).

[0067] Through testing, the thermal conductivity of the g...

Embodiment 2

[0069] The steps for preparing the heat dissipation film are:

[0070] Coating a graphene oxide dispersion on the surface of the substrate, wherein the mass concentration of graphene oxide in the graphene oxide dispersion is 5.8%;

[0071] The graphene dispersion is evaporated to dryness, so as to obtain the graphene oxide film;

[0072] Place the graphene oxide film in the reducing agent solution for a period of time and then carry out the reduction treatment to obtain the expanded graphene original film, wherein the reducing agent is hydrazine hydrate, and the molar concentration of the reducing agent in the reducing agent solution is 0.8mol / L. The temperature is 2900°C, the time is 30 minutes, and the density of the original expanded graphene film is 0.5g / cm 3 ;

[0073] The original expanded graphene film is placed in a 3D mold for calendering to obtain a graphene film (i.e. a heat dissipation film).

[0074] Through testing, the thermal conductivity of the graphene fil...

Embodiment 3

[0076] The steps for preparing the heat dissipation film are:

[0077] Coating a graphene oxide dispersion on the surface of the substrate, wherein the mass concentration of graphene oxide in the graphene oxide dispersion is 6.2%;

[0078] The graphene dispersion is evaporated to dryness, so as to obtain the graphene oxide film;

[0079] Place the graphene oxide film in the reducing agent solution for a period of time and then carry out the reduction treatment to obtain the expanded graphene original film, wherein the reducing agent is sodium borohydride, and the molar concentration of the reducing agent in the reducing agent solution is 0.6mol / L. The temperature of the treatment is 2900°C, the time is 1 hour, and the density of the expanded graphene original film is 0.8g / cm 3 ;

[0080] The original expanded graphene film is placed in a 3D mold for calendering to obtain a graphene film (i.e. a heat dissipation film).

[0081] Through testing, the thermal conductivity of th...

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Abstract

The application provides a heat dissipation film, a preparation method thereof, a chip component and an electronic device. The heat dissipation film includes a graphene film, and the graphene film includes: a base; at least one raised portion, at least one raised portion is arranged on the base, and is integrally formed with the base, wherein, in the graphene film Contains no binders. Thereby, graphene film comprises base body and protrusion, constitutes the graphene film of a 3D structure, and the graphene film of this structure and the heat source electronic parts (such as chip) of different heights can be matched and combined to set; Graphene film of the present application There is no binder in it, which can greatly improve the thermal conductivity of the graphene film, improve the heat dissipation rate of the heat dissipation film, and then better dissipate the heat of the heat source electronic parts.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, and in particular, relates to a heat dissipation film and a preparation method thereof, chip components and electronic equipment. Background technique [0002] At present, the heat sink materials commonly used in electronic products include graphite sheet, thermal silica gel, thermal gel, thermal tape and other materials, but the heat dissipation effect is still lacking, and the structure is single, which is not conducive to heat sink and heat source electronic parts ( Such as the assembly of chips), which in turn affects the heat dissipation effect. [0003] Therefore, the research on the heat dissipation film needs to be deepened. Contents of the invention [0004] This application aims to solve one of the technical problems in the related art at least to a certain extent. Therefore, one purpose of the present application is to propose a heat dissipation film with a h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/373
CPCH01L23/367H01L23/373
Inventor 杨鑫
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD