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Method for quickly forming oxidation film layer on surface of aluminum substrate

An oxide film layer, aluminum substrate technology, applied in surface reaction electrolytic coating, anodizing, coating and other directions, can solve the problems of complex oxidation treatment process steps, time-consuming, increasing oxide film layer, etc.

Inactive Publication Date: 2020-02-07
乾乐欣展新材料技术(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a method for quickly forming an oxide film layer on the surface of an aluminum substrate, which has the advantages of rapidly forming an oxide film layer, etc., and solves the problem that the existing aluminum substrate surface oxidation treatment process steps are complicated and each A treatment process takes too much time, which greatly increases the problem of oxide film formation

Method used

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Embodiment Construction

[0016] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0017] A method for rapidly forming an oxide film layer on the surface of an aluminum substrate, comprising the following steps:

[0018] 1) For the pretreatment of the aluminum substrate, first inject half of the clean water into the cleaning tank, then slowly add the calculated amount of AC under stirring, and then replenish the water to the specified volume, then add the aluminum substrate to be cleaned into the cleaning tank for ultrasonic cleaning 2-10 minutes, after the ...

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Abstract

The invention relates to the technical field of aluminum substrates and discloses a method for quickly forming an oxidation film layer on the surface of an aluminum substrate. The method comprises thefollowing steps of pretreatment of the aluminum substrate, dilute nitric acid neutralization of the aluminum substrate, surface roughening treatment of the aluminum substrate, oxidation treatment ofthe aluminum substrate, acid-base neutralization of the surface of the aluminum substrate and drying of the aluminum substrate. According to the method for quickly forming the oxidation film layer onthe surface of the aluminum substrate, after the aluminum substrate is put in, an AC solution can sufficiently react with the aluminum substrate, the cleaning speed of surface grease can be accelerated, a natural oxidation layer can also be removed, it can be avoided that treatment time is prolonged as a later process is influenced, and then neutralization is carried out on remaining assisting liquid; besides, the cleaning efficiency is improved under ultrasonic cleaning, finally water drip treatment is carried out on the aluminum substrate obtained after oxidation treatment, and then drying is carried out; and in this way, the machining reaction time is greatly shortened, machining errors are reduced, oxidation rework is avoided, and the purpose of quick formation is achieved.

Description

technical field [0001] The invention relates to the technical field of aluminum substrate technology, in particular to a method for rapidly forming an oxide film layer on the surface of an aluminum substrate. Background technique [0002] Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided panel is composed of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. It is also designed as a double-sided panel for high-end use. , the structure is a circuit layer, an insulating layer, an aluminum base, an insulating layer and a circuit layer. The processing and treatment process to formulate reasonable and feasible specifications to ensure the smooth progress of the production process, the basic process includes cutting, drilling, dry film imaging, board inspection, etching, corrosion inspection, green oil, characters, green inspection, spraying Tin, aluminu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D11/16C25D11/06C25D11/18
CPCC25D11/06C25D11/16C25D11/18
Inventor 周文英程展李长岭张剑丁金龙施华吴伟夏海燕别红玲
Owner 乾乐欣展新材料技术(上海)有限公司