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Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film

A technology of electromagnetic shielding film and printed circuit board, which is applied in the field of electronics, can solve the problems of electromagnetic interference and low shielding efficiency of the shielding film, and achieve the effects of increasing bendability, ensuring reliability, and avoiding blistering and delamination

Pending Publication Date: 2020-02-07
GUANGZHOU FANGBANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the influence of the structure and characteristics of the shielding film itself, the shielding effectiveness of the commonly used shielding film is low, so there is still the problem of electromagnetic interference in high-frequency and high-speed signal transmission.

Method used

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  • Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film
  • Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film
  • Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film

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Embodiment Construction

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0042] see figure 1 , is a structural schematic diagram of an angle of the electromagnetic shielding film provided in Embodiment 1 of the present invention;

[0043] see figure 2 , is a structural schematic diagram of another angle of the electromagnetic shielding film provided by Embodiment 1 of the present invention;

[0044] combine figure 1 with figure 2 As shown, the electromagnetic shielding film includes a first shielding layer 1, a first insulating la...

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Abstract

The embodiment of the invention provides an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film. The electromagnetic shielding film includesa first shielding layer, a first insulating layer, a second shielding layer and an adhesive film layer that are sequentially stacked. The first shielding layer is provided with a first through hole running through the upper and lower surfaces thereof, and the second shielding layer is provided with a second through hole running through the upper and lower surfaces thereof. By setting the first insulating layer between the first shielding layer and the second shielding layer, the first insulating layer can isolate the first shielding layer and the second shielding layer in an electric insulation state, so when pulsed electromagnetic wave of an instantaneous high voltage caused by noise or static electricity on one side or the other side of the electromagnetic shielding film passes through the electromagnetic shielding film, the external noise or electromagnetic wave can be shielded in multiple stages with the cooperation of the first shielding layer and the second shielding layer; and the noise or electromagnetic wave is prevented from passing through the electromagnetic shielding film. Therefore, extremely high shielding effectiveness is realized; and the invention is suitable forultra-high frequency and high-speed transmission.

Description

technical field [0001] The invention relates to the field of electronics, in particular to an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film. Background technique [0002] With the rapid development of the electronics industry, electronic products are further developed toward miniaturization, light weight, and high-density assembly, which greatly promotes the development of flexible circuit boards, thereby realizing the integration of component devices and wire connections. Flexible circuit boards can be widely used in industries such as mobile phones, liquid crystal displays, communications and aerospace. [0003] Driven by the international market, functional flexible circuit boards dominate the flexible circuit board market, and an important indicator for evaluating the performance of functional flexible circuit boards is electromagnetic shielding (Electromagnetic Interference Shielding, referred to as EMI Sh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H05K1/02C09J7/29C09J9/02B32B15/04B32B15/20B32B15/18B32B9/04B32B9/00B32B7/12B32B3/24B32B33/00B32B37/12
CPCH05K9/0088H05K1/0218C09J7/29C09J9/02B32B15/04B32B15/20B32B15/18B32B9/04B32B9/007B32B9/00B32B7/12B32B3/266B32B33/00B32B37/12H05K2201/0715B32B2307/212B32B2307/102C09J2301/314C09J2301/16C09J2301/122
Inventor 苏陟
Owner GUANGZHOU FANGBANG ELECTRONICS