Hyperbranched polymer-SiO2 modified epoxy resin insulating material and preparation method thereof

Abstract

The invention relates to the technical field of epoxy resin adhesives, and discloses a hyperbranched polymer-SiO2 modified epoxy resin insulating material and a preparation method thereof. The hyperbranched polymer-SiO2 modified epoxy resin insulating material is prepared from the following formula materials: hyperbranched polymer, nanosilicon dioxide, a silane coupling agent, a catalyst, dodecylsuccinic anhydride and epoxy resin. A three-dimensional net-like spherical structure of the hyperbranched polymer has a high degree of molecular branching, so that nano-SiO2 is uniformly dispersed on the huge specific surface of the hyperbranched polymer, nano-SiO2 agglomeration is reduced, nano-SiO2 reduces the effective charge and charge accumulation in a coating interface area, the diffusion rate of a carrier is reduced, the formation of conductive paths is suppressed, the breakdown characteristics of epoxy resin coatings are improved, the hyperbranched polymer has excellent elastic expansion structure and good structural stability, the crosslinking density of the epoxy resin is increased, the mobility of a molecular segment of the epoxy resin is suppressed, and the impact cross sectioncaused by the stress expansion of the resin is reduced.

Description

technical field

[0001] The invention relates to the technical field of epoxy resin adhesives, in particular to a hyperbranched polymer-SiO 2 Modified epoxy resin insulating material and its preparation method. Background technique

[0002] Adhesive bonding refers to the technology of connecting the surfaces of homogeneous or heterogeneous objects with adhesives. It has the characteristics of continuous stress distribution and light weight. Adhesive bonding is suitable for the connection of materials of different materials, different thicknesses and complex components. There are many classification methods of adhesives. Generally, adhesives are composed of bonding substances, curing agents, toughening agents, diluents, modifiers, etc., mainly polyacrylates, polyamides and other thermoplastic adhesives, urea-formaldehyde resins, epoxy resins, etc. Thermosetting adhesives such as resins, synthetic rubber adhesives such as neoprene rubber and polyurethane rubber, rubber resin a...