Low-temperature cutting method and device suitable for HIT battery

Abstract

The invention provides a low-temperature cutting method and device suitable for an HIT battery. The method comprises the steps that a water jet flow beam and a laser beam are mixed, the laser beam penetrates through the water jet flow beam, and is sprayed out through a jet flow nozzle, and a water jet flow laser beam is formed; the water jet flow laser beam carries out cutting on the surface of the HIT battery according to the preset scanning path; and the water jet flow beam sprayed out of the jet flow nozzle carries out washing on molten slag generated by machining, and the laser machining area on the HIT battery is cooled. The efficiency losses of cutting to the HIT battery can be greatly reduced, through the high-speed water jet flow beam, the laser machining area is cooled, washing iscarried out, a re-casting layer is reduced, and the surface and the cross section of the HIT battery obtained after cutting are free of casting layer, hot stress and micro cracks.

Description

Technical field [0001] The invention relates to the field of solar cell processing, in particular to a low-temperature cutting method and device suitable for HIT cells. Background technique [0002] Because of its clean, safe, convenient and high-efficiency characteristics, solar photovoltaic power generation has become an emerging industry that is generally concerned and developed by all countries in the world. Therefore, in-depth research and utilization of solar energy resources are of great significance to alleviating the resource crisis and improving the ecological environment. [0003] HIT is the abbreviation of Heterojunction with intrinsic Thin-layer, which means intrinsic thin film heterojunction. Because HIT has been applied for as a registered trademark by Sanyo Corporation of Japan, it is also called HJT, HDT or SHJ. This type of solar cell was first successfully developed by Sanyo Corporation of Japan in 1990. At that time, the conversion efficiency could reach 14.5% ...

AI Technical Summary

Problems solved by technology

However, laser processing also has the defect of thermal damage in the processing area.

According to reports, the efficiency of conventional passivated emitter and rear cells (PERC cells) is reduced by about 0.1% after slicing in half, and the damage to heterojunction cells (HIT cells) is particularly serious. According to laboratory data, every cut, HIT The battery efficiency drops by more than 0.5%

The large loss of cutting efficiency severely limits the progress of HIT cells to the development of shingled technology

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