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A kind of white polyimide composite film and preparation method thereof

A polyimide and composite film technology, applied in the field of material science, can solve the problems of poor temperature resistance of the coating layer, low operating temperature, and high addition of inorganic fillers, and achieve easy popularization and application, improved mechanical properties, and excellent mechanical properties. Effect

Active Publication Date: 2021-08-17
WUXI SHUNXUAN NEW MATERIALS +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One way is to form a double-layer composite white polyimide film by coating white resin (such as white epoxy resin, etc.) on the polyimide film; The temperature resistance of the layer is poor, and the usable temperature is low. At the same time, there will be problems such as non-bonding of the two layers, cracking and peeling.
Another way is to add white inorganic fillers in the process of preparing polyimide films to form a uniform single-layer white polyimide film. The white polyimide film prepared by this method is too high due to the addition of inorganic fillers. Causes deviations in the mechanical properties of the film

Method used

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  • A kind of white polyimide composite film and preparation method thereof
  • A kind of white polyimide composite film and preparation method thereof
  • A kind of white polyimide composite film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] The schematic diagram of the white polyimide composite film PI111 in the present embodiment 1 is as follows figure 1 Shown:

[0038] The preparation method of above-mentioned white polyimide composite film PI111 is as follows:

[0039] (1) Preparation of glue solution PI-1.1

[0040] Weigh TiO 2 3.0g into a round bottom flask, add solvent N,N-dimethylacetamide (DMAc) 80.0g, ultrasonically stir for 1h, then protect with argon, and add 15.0g of soluble PI, continue stirring at room temperature for 5h , to obtain transparent, homogeneous and viscous white transparent polyimide glue PI-1.1.

[0041] (2) Preparation of glue solution PI-2.1

[0042] Weigh 6.0072g (0.03mol) of 4,4'-diaminodiphenyl ether (ODA) and 50g of N,N-dimethylacetamide (DMAc) into a 100mL round-bottom flask, protect it with argon, and wait until it is completely dissolved Then add 6.5436 g (0.03 mol) of pyromellitic dianhydride (PMDA), and continue stirring at room temperature for 12 hours to obtain...

Embodiment 2

[0049] The schematic diagram of the polyimide film PI212 in the present embodiment 2 is as shown in PI111, and preparation method is as follows:

[0050] (1) Preparation of glue solution PI-1.2

[0051] Weigh TiO 2 5.0g into a round bottom flask, add solvent N,N-dimethylacetamide (DMAc) 80.0g, ultrasonically stir for 1h, then protect with argon, and add 15.0g of soluble PI, continue stirring at room temperature for 5h , to obtain transparent, homogeneous and viscous white transparent polyimide glue PI-1.2.

[0052] Steps (2) to (4) are consistent with those in Example 1 to obtain a white polyimide composite film PI212.

[0053] The test results of PI212 white polyimide composite film are as follows: the tensile strength of PI212 is 95.0 MPa, the elongation at break is 12.3%, the L value is 96.2, and the b value is 4.3.

Embodiment 3

[0055] The schematic diagram of the polyimide film PI313 in the present embodiment 3 is as shown in PI111, and preparation method is as follows:

[0056] (1) Preparation of glue solution PI-1.3

[0057] Weigh TiO 2 10.0g into a round bottom flask, add solvent N,N-dimethylacetamide (DMAc) 80.0g, ultrasonically stir for 1h, then protect with argon, and add soluble PI 10.0g, keep stirring at room temperature for 5h , to obtain transparent, homogeneous and viscous white transparent polyimide glue PI-1.3.

[0058] Steps (2) to (4) are consistent with those in Example 1 to obtain a white polyimide composite film PI313.

[0059] The test results of PI313 white polyimide composite film are as follows: the tensile strength of PI313 is 80.7MPa, the elongation at break is 5.2%, the L value is 98.3, and the b value is 1.2.

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Abstract

The invention discloses a white polyimide composite film and a preparation method thereof. The composite film comprises a three-layer structure, wherein the surface layer is a white polyimide layer, and the core layer is a polyimide layer; the preparation method is: ( 1) Preparation of white polyimide glue solution: first make TiO 2 Disperse in a solvent, then add polyimide, and mix evenly; (2) Preparation of the precursor glue of the core layer polyimide: dissolve the diamine monomer in the solvent, add the dianhydride monomer after completely dissolving, Stir the reaction to obtain the precursor glue of polyimide; (3) coating of glue: coat the precursor glue of white polyimide, core layer polyimide and white polyimide on the substrate successively. imide glue solution to obtain a multi-layer composite coating; (4) preparation of the film: the multi-layer composite coating is placed in an oven, the temperature is raised, and then naturally cooled to obtain a white polyimide composite film. The invention provides a white polyimide composite film with better mechanical properties and lower yellowness value.

Description

technical field [0001] The invention relates to the technical field of material science, and more specifically relates to a white polyimide composite film and a preparation method thereof. Background technique [0002] Polyimide film is a special engineering plastic with many advantages such as high temperature resistance, high mechanical strength, and low thermal expansion coefficient. It has been widely used in electronic circuits, aerospace, new energy, lighting and other fields. With the continuous upgrading of technology, polyimide film needs to be multi-functional and refined. White polyimide film is a new type of functionalized polyimide material. [0003] In order to prepare white polyimide film, there are two commonly used techniques as follows. One way is to form a double-layer composite white polyimide film by coating white resin (such as white epoxy resin, etc.) on the polyimide film; The temperature resistance of the layer is poor, and the usable temperature ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08K3/22C08J7/04C08J5/18
CPCC08J5/18C08J7/042C08J2379/08C08J2479/08C08K2003/2241
Inventor 贝润鑫张艺刘宸宇刘顺祯
Owner WUXI SHUNXUAN NEW MATERIALS
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