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Preparation method of silver-plated copper powder

A technology of silver-plated copper powder and copper powder, which is applied in the field of preparation of silver-plated copper powder, can solve the problems of high production cost and inapplicability to mass production, and achieve low cost, improved silver plating effect, and good oil removal effect Effect

Inactive Publication Date: 2020-03-24
烟台屹海新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The above-mentioned technical solution has the following defects: the electrical conductivity of the silver-plated copper powder is improved by increasing the silver content, the production cost is high, and it is not suitable for mass production

Method used

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  • Preparation method of silver-plated copper powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A preparation method of silver-plated copper powder, specifically comprising the steps of:

[0039] Step 1. Soak 1kg of copper powder in 1000mL of 5wt% sodium hydroxide solution, the temperature of the sodium hydroxide solution is 60°C and keep stirring for 30min;

[0040] Step 2. Weigh 0.1kg of ethylene glycol and mix it with an equal amount of water, and add the prepared ethylene glycol solution directly into step 1, continue to stir, then raise the temperature to 30°C and keep it warm;

[0041] Step 3. Add sodium hydroxide and ammonia water to deionized water until completely dissolved to obtain solution A. The pH of solution A is controlled at 9. Weigh 16g of silver nitrate and dissolve it in 100mL deionized water to obtain solution B. Slowly added to solution A under stirring conditions to prepare complexed silver salt solution, then raise the temperature to 30°C and keep it warm;

[0042]Step 4. Add the complexed silver salt solution obtained in step 3 to the cop...

Embodiment 2

[0046] A preparation method of silver-plated copper powder, specifically comprising the steps of:

[0047] Step 1. Soak 1kg of copper powder in 1000mL of 5wt% sodium hydroxide solution, the temperature of the sodium hydroxide solution is 70°C and keep stirring for 30min;

[0048] Step 2. Weigh 0.5kg of hydrazine hydrate and mix it with an equal amount of water, and add the prepared hydrazine hydrate solution directly into step 1, continue stirring, and then heat up to 30°C and keep it warm;

[0049] Step 3. Add sodium hydroxide and ammonia water to deionized water until completely dissolved to obtain solution A. The pH of solution A is controlled at 10. Weigh 32g of silver nitrate and dissolve it in 100mL deionized water to obtain solution B. Slowly added to solution A under stirring conditions to prepare complexed silver salt solution, then raise the temperature to 40°C and keep it warm;

[0050] Step 4. Add the complexed silver salt solution obtained in step 3 to the copper...

Embodiment 3

[0054] A preparation method of silver-plated copper powder, specifically comprising the steps of:

[0055] Step 1. Soak 1kg of copper powder in 1000mL of 5wt% sodium hydroxide solution, the temperature of the sodium hydroxide solution is 80°C and keep stirring for 30min;

[0056] Step 2. Weigh 0.5kg of ethylene glycol and 0.5kg of hydrazine hydrate and mix them evenly with 1kg of water. Add the prepared reducing agent solution directly into step 1, continue stirring, and then heat up to 30°C and keep it warm;

[0057] Step 3. Add sodium hydroxide and ammonia water to deionized water until completely dissolved to obtain solution A. The pH of solution A is controlled at 10. Weigh 48g of silver acetate and dissolve it in 100mL deionized water to obtain solution B. Slowly added to solution A under stirring conditions to prepare complexed silver salt solution, then raise the temperature to 40°C and keep it warm;

[0058] Step 4. Add the complexed silver salt solution obtained in s...

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Abstract

The invention relates to a preparation method of silver-plated copper powder. The method comprises the steps that firstly, copper powder is placed into a sodium hydroxide solution to be soaked, stirring continues to be performed for 30 min, a reducing agent solution is prepared to be added into the copper powder, stirring continues to be performed, a silver complex salt solution is prepared and added into the copper powder containing a reducing agent, stirring is performed, the temperature is controlled to be 35-45 DEG C, the stirring time is 110-130 min, after stirring is ended, solids are separated out from the solution, and the silver content is 1-5%; the solids obtained after centrifugal separation are washed through deionized water, a sulfuric acid solution of the mass fraction being2% is added for neutralization, then, pH is regulated to 6-7, and then, centrifugal separation is performed; filter cakes obtained after centrifugal separation are sheared and dispersed through high-speed dispersion, then, the filter cakes are placed into a vacuum drying box to be dried, and the silver-plated copper powder is obtained. The silver content of the prepared silver-plated copper powderis 1-5%, the conductive performance of the silver-plated copper powder is good, and the preparation method has the effects that the production cost is low, the preparation technology is simple, the efficiency is high, and the method is environmentally friendly.

Description

technical field [0001] The invention belongs to the technical field of surface treatment, relates to the technical field of metal powder silver plating, and in particular relates to a preparation method of silver-plated copper powder. Background technique [0002] With the vigorous development of electronic science and technology, electronic packaging technology, as an important part of modern electronic technology, has put forward higher and stricter requirements for electronic packaging technology. With the development of microelectronic packaging technology in the direction of high speed, high density and miniaturization, traditional Pb / Sn soldering materials cannot meet the technical requirements due to low resolution and high connection temperature. The older and more researchers began to study conductive adhesives. Conductive adhesives are an adhesive with dual properties of conductivity and adhesion. It can connect various conductive materials together to form an elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F9/24
CPCB22F9/24B22F1/14
Inventor 宋曰海马丽杰
Owner 烟台屹海新材料科技有限公司