A kind of electromagnetic wave protective coating and preparation method thereof

A protective coating, electromagnetic wave technology, applied in the coating, metal material coating process, vacuum evaporation coating and other directions, can solve the problem of unsuitable wave absorbing materials, etc., achieves simple preparation method, low synthesis temperature, and low material cost Effect

Active Publication Date: 2021-10-15
FUJIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The resistivity of SiC is 109~1010 Ω•m (α-SiC) or > 106 Ω•m (β-SiC), which is not suitable for direct use as a wave-absorbing material

Method used

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  • A kind of electromagnetic wave protective coating and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment one: if figure 1 As shown, an electromagnetic wave protective coating includes a composite film layer located on the surface of a substrate 100. The composite film layer includes an adhesive layer 200, an inner layer 300, a first transition layer 400, and a second transition layer arranged sequentially from the inside to the outside. Layer 500 and outer layer 600, the bonding layer is an aluminum nickel layer, the inner layer is an aluminum nickel / aluminum oxide layer, the first transition layer is an aluminum oxide / silicon carbide layer, and the second transition layer is a silicon carbide layer / Diamond-like layer, the outer layer is a diamond-like layer, wherein the substrate is used as an outer shell of an electronic device.

[0026] In this embodiment, the contents of aluminum and nickel in the bonding layer are 50%, the contents of aluminum, nickel and aluminum oxide in the inner layer are 35%, 35% and 30% respectively, and the oxide in the first transi...

Embodiment 2

[0037] Embodiment two: if figure 1 As shown, an electromagnetic wave protective coating includes a composite film layer located on the surface of a substrate 100. The composite film layer includes an adhesive layer 200, an inner layer 300, a first transition layer 400, and a second transition layer arranged sequentially from the inside to the outside. Layer 500 and outer layer 600, the bonding layer is an aluminum nickel layer, the inner layer is an aluminum nickel / aluminum oxide layer, the first transition layer is an aluminum oxide / silicon carbide layer, and the second transition layer is a silicon carbide layer / Diamond-like layer, the outer layer is a diamond-like layer, wherein the substrate is used as an outer shell of an electronic device.

[0038] In this embodiment, the contents of aluminum and nickel in the bonding layer are 50%, the contents of aluminum, nickel and aluminum oxide in the inner layer are 35%, 35% and 30% respectively, and the oxide in the first transi...

Embodiment 3

[0049] Embodiment three: as figure 1 as shown in figure 1 As shown, an electromagnetic wave protective coating includes a composite film layer located on the surface of a substrate 100. The composite film layer includes an adhesive layer 200, an inner layer 300, a first transition layer 400, and a second transition layer arranged sequentially from the inside to the outside. Layer 500 and outer layer 600, the bonding layer is an aluminum nickel layer, the inner layer is an aluminum nickel / aluminum oxide layer, the first transition layer is an aluminum oxide / silicon carbide layer, and the second transition layer is a silicon carbide layer / Diamond-like layer, the outer layer is a diamond-like layer, wherein the substrate is used as an outer shell of an electronic device.

[0050] In this embodiment, the contents of aluminum and nickel in the bonding layer are 50%, the contents of aluminum, nickel and aluminum oxide in the inner layer are 35%, 35% and 30% respectively, and the o...

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Abstract

The invention relates to an electromagnetic wave protective coating, which comprises a composite film layer located on the surface of a substrate, and the composite film layer includes an adhesive layer, an inner layer, a first transition layer, a second transition layer and an outer layer arranged in sequence from the inside to the outside , the bonding layer is an aluminum-nickel layer, the inner layer is an aluminum-nickel / aluminum oxide layer, the first transition layer is an aluminum oxide / silicon carbide layer, and the second transition layer is a silicon carbide / diamond-like carbon layer, so The outer layer is a diamond-like layer. The electromagnetic wave protective coating of the present invention has a strong absorption and attenuation effect on electromagnetic waves, while the ratio of reflection attenuation is low, has the advantages of low reflection and high absorption, good electromagnetic wave absorption performance and heat dissipation performance, good wear resistance and high temperature resistance, so It has a great application prospect in the fields of electromagnetic wave absorbing film and shielding.

Description

technical field [0001] The invention relates to an electromagnetic wave protective coating and a preparation method thereof. Background technique [0002] With the development of science and technology and electronic information industry, especially the miniaturization and high integration of electronic components and the light weight, high speed and digitization of electronic instruments and meters, the signal level is small, and they are susceptible to external electromagnetic interference and make their actions wrong, thus With the rapid development of the modern electronics industry and the sharp increase in the number of various commercial and household electronic products, especially the miniaturization, integration, light weight and digitalization of electronic circuits and components, electronic products are vulnerable to the outside world. Misoperation, image disturbance and sound disturbance due to electromagnetic wave interference. At the same time, these electro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35C23C14/14C23C14/08C23C14/58C23C14/06
CPCC23C14/0605C23C14/0635C23C14/081C23C14/14C23C14/35C23C14/352C23C14/5806
Inventor 简明德黄旭许明三
Owner FUJIAN UNIV OF TECH
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