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A kind of aluminum nitride ceramic copper-clad substrate and preparation method thereof

A technology of aluminum nitride ceramics and copper clad substrates, applied in the field of aluminum nitride ceramic metallization, can solve the problems of the surface aluminum oxide film is not dense, the gas cannot be discharged, the contact area between the copper layer and the ceramic layer becomes smaller, etc. Strength boosting effect

Active Publication Date: 2021-11-12
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Specifically, the surface aluminum oxide film formed by the oxidation of the aluminum nitride ceramic substrate is not dense, while the copper foil used in the DBC (direct copper clad) process is oxidized on the surface, and there is a layer of cuprous oxide film on the surface. During the copper clad process, the contact layer copper and cuprous oxide will form a liquid phase, which will infiltrate from the loose oxide film and contact with aluminum nitride, react and release nitrogen gas, which cannot be discharged, and often produces a small gap between the ceramic layer and the copper layer. Bubbles and bulges, which in turn lead to a smaller contact area between the copper layer and the ceramic layer, thereby reducing the bonding strength of the copper layer and the ceramic layer

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  • A kind of aluminum nitride ceramic copper-clad substrate and preparation method thereof
  • A kind of aluminum nitride ceramic copper-clad substrate and preparation method thereof
  • A kind of aluminum nitride ceramic copper-clad substrate and preparation method thereof

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preparation example Construction

[0062] According to the second aspect of the present disclosure, the preparation method may further include a pretreatment process before step S1, and the pretreatment process includes: the aluminum nitride ceramic substrate may be subjected to ultrasonic cleaning, alkaline solution cleaning, alcohol cleaning, Wash and dry. Ultrasonic cleaning can be carried out in medium water, the alkaline solution can be sodium hydroxide solution, and the acidic solution can be sulfuric acid solution. The condition of described pretreatment can be: deionized water ultrasonic cleaning time is 2-10min, the concentration of the NaOH solution used when alkaline solution cleaning is 5-20% by weight, cleaning time is 5-60min, the concentration of alcohol is 30-95% by volume, the cleaning time is 5-60min, and the drying can be dried with hot air at a temperature of 30-70°C.

[0063] According to the second aspect of the present disclosure, the magnetron sputtering in step S1 includes vacuuming, a...

Embodiment 1

[0074] In this embodiment, the target plated on the surface of the aluminum nitride ceramic is silicon dioxide; the thickness of the aluminum nitride ceramic substrate used is 0.63mm, the surface roughness Ra is 0.4μm, the thickness of the copper foil is 0.3mm, and the SiO 2 The coating thickness is 0.2 μm.

[0075] The production process is as follows: ①The pretreatment process of the aluminum nitride ceramic substrate: first use deionized water to ultrasonically clean for 3 minutes, then wash with 10% by weight NaOH solution for 10 minutes, and then use 95% by volume of industrial alcohol to clean for 10 minutes, and finally Rinse with deionized water and dry with hot air at 50°C; ②Put the pretreated aluminum nitride ceramic substrate in the coating equipment to coat SiO 2 , the coating time is 100min (according to experience, the deposition rate of the target is 2nm / min); The oxygen content is 90% by volume, the gas flow rate is 2.0L / min, the temperature is raised to 1300°...

Embodiment 2

[0077] The difference from Example 1 is that the target material coated on the surface of aluminum nitride ceramics in this example is zirconia.

[0078] The thickness of the aluminum nitride ceramic substrate used is 0.63mm, the surface roughness Ra is 0.4μm, the thickness of the copper foil is 0.3mm, ZrO 2 The coating thickness is 0.2 μm.

[0079] The production process is as follows: ①The pretreatment process of the aluminum nitride ceramic substrate: first use deionized water to ultrasonically clean for 3 minutes, then use 10% by weight NaOH solution to clean for 10 minutes, then use 95% by volume industrial alcohol to clean for 10 minutes, and finally use Rinse with deionized water and dry with hot air at 50°C; ②Place the pretreated aluminum nitride ceramic substrate in the coating equipment to coat ZrO 2 , the coating time is 100min (according to experience, the deposition rate of the target is 2nm / min); The oxygen content is 90% by volume, the gas flow rate is 2.0L / mi...

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Abstract

The present disclosure relates to an aluminum nitride ceramic copper-clad substrate and a preparation method thereof. The aluminum nitride ceramic copper-clad substrate includes an aluminum nitride ceramic substrate and a copper foil covered on at least one surface of the aluminum nitride ceramic substrate. An interfacial bonding layer is formed between the aluminum nitride ceramic substrate and the copper foil; the interfacial bonding layer contains CuAlO 2 , the interface bonding layer also contains Al 2 Zr 3 o 9 、Al 2 Si 3 o 9 , AlCrO 3 、Cu 2 ZrO 3 、Cu 2 SiO 3 and CuCrO 2 one or more of. The aluminum nitride ceramic copper-clad substrate of the present disclosure reduces the gas and bubbling between the ceramic substrate and the copper foil, and the bonding strength between the ceramic substrate and the copper foil is further significantly improved.

Description

technical field [0001] The present disclosure relates to the technical field of metallization of aluminum nitride ceramics, in particular to an aluminum nitride ceramic copper-clad substrate and a preparation method thereof. Background technique [0002] Aluminum nitride ceramic copper-clad laminate is a direct bonding of rolled copper sheet and aluminum nitride ceramic substrate through DBC technology (direct copper cladding). Since the aluminum nitride substrate and the copper-oxygen eutectic are not wet, it is necessary to The aluminum nitride ceramic substrate is modified on the surface to improve its wettability with the copper-oxygen eutectic, so as to realize the direct copper cladding of the aluminum nitride ceramic substrate. The existing technical solutions generally mainly adopt the oxidation treatment of the aluminum nitride ceramic substrate to form a thin layer of aluminum oxide on the surface, and use the copper-oxygen eutectic liquid phase to wet the surface ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B37/02
CPCC04B37/025C04B2237/062C04B2237/068C04B2237/54
Inventor 宋山青徐强吴波
Owner BYD CO LTD
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