Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Low-power-consumption and low-leakage SRAM applied to storage and calculation integrated chip

A low-power, low-leakage technology, applied in information storage, static memory, digital memory information, etc., can solve the problems of SRAM read and write performance decline, SRAM power consumption increase, SRAM power supply voltage is difficult to reduce and other problems, to reduce the minimum work effect of voltage, reduced power consumption, improved static noise margin

Active Publication Date: 2020-03-31
TIANJIN UNIV
View PDF5 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]Since SRAM occupies the main area of ​​the memory-computing chip, SRAM seriously affects the power consumption of the memory-computing chip
At this stage, the power consumption of SRAM is mainly reduced by reducing the power supply voltage. However, the reduction of power supply voltage will reduce the read and write performance of SRAM and make it difficult to drop the power supply voltage of SRAM. The leakage charge of the bit line on the selected cell will increase the power consumption of the SRAM during operation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Low-power-consumption and low-leakage SRAM applied to storage and calculation integrated chip
  • Low-power-consumption and low-leakage SRAM applied to storage and calculation integrated chip
  • Low-power-consumption and low-leakage SRAM applied to storage and calculation integrated chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0037] Such as figure 1 As shown, the low-power and low-leakage SRAM applied to the storage and calculation integrated chip of the present invention is optimized based on the traditional SRAM structure, and will work in a low power supply voltage environment near the threshold to reduce the power consumption of the SRAM, including the storage and calculation unit array, a ground voltage boost module and a bit line charge recovery module.

[0038] The SRAM storage operation unit array module is composed of N rows and M columns of storage operation units, each storage operation unit is composed of a storage module and an operation module, the module can realize voltage signal input, and ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a low-power-consumption and low-leakage SRAM applied to a storage and calculation integrated chip. The low-power-consumption and low-leakage SRAM comprises: an SRAM storage operation unit array which comprises N rows and M columns of storage operation units, wherein each storage operation unit comprises a storage module and an operation module and is used for realizing voltage signal input, storing input data in the storage module and calculating and outputting the data by the operation module; a ground wire voltage raising module which is used for raising the voltage of the power supply ground wire of the selected column in the SRAM storage operation unit array so as to improve the writing threshold value of the full-selection unit when the SRAM writes data; and abit line charge recovery module which is used for recovering the leakage charge of the bit line of the half-selection unit when the SRAM writes data so as to drive the ground line voltage lifting module, reducing the voltage of the bit line of the half-selection unit and improving the static noise margin of the half-selection unit. According to the invention, the arithmetic logic unit is integrated into the SRAM, so that the design of the storage and calculation integrated chip is realized.

Description

technical field [0001] The invention relates to the technical field of integrated circuit design, in particular to a low-power consumption and low-leakage SRAM applied to an integrated storage and calculation chip. Background technique [0002] The Von Neumann computer system architecture separates the arithmetic unit from the memory and uses a bus structure to communicate. As the semiconductor process node enters the deep sub-micron level, the von Neumann structure will be limited by the transmission bandwidth of the bus structure, so that applications such as cloud computing, artificial intelligence and neural networks will be limited by the performance and functionality of the traditional von Neumann structure. consumption bottleneck. [0003] In order to overcome the above-mentioned bottleneck, the memory-computing integrated chip that integrates the memory and the arithmetic unit can directly use the data output by the memory for calculation, reducing the additional po...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G11C11/412G11C11/419
CPCG11C11/4125G11C11/419Y02D10/00
Inventor 陈霏郭春成
Owner TIANJIN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products