Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof

Abstract

The invention discloses a parallel seam welding alloy cover plate for integrated circuit packaging and a preparation method thereof, and belongs to the technical field of integrated circuit manufacturing. The preparation method of the parallel seam welding alloy cover plate for the integrated circuit packaging comprises the following steps of spraying the four side surfaces of an alloy cover platecolumn to form a first nickel protective layer by using a plasma spraying process; cutting the alloy cover plate column into a single alloy cover plate in the transverse direction; performing deburring treatment on the alloy cover plate; forming a T-shaped alloy cover plate body by adopting machining or chemical corrosion; and plating nickel on the outer surface of an alloy cover plate body to form a second nickel protection layer. According to the parallel seam welding alloy cover plate for the integrated circuit packaging and the preparation method thereof, the four side surfaces of the alloy cover plate column is sprayed to form the first nickel protection layer, the single alloy cover plate is formed after cutting, the side surfaces of the alloy cover plate column are sprayed to formthe first nickel protection layer easily, the thickness of the obtained first nickel protection layer is relatively thick, and the salt spray corrosion resistance can be higher.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to a parallel seam welding alloy cover plate for integrated circuit packaging and a preparation method thereof. Background technique [0002] Parallel seam welding is an important cover sealing technology for highly reliable integrated circuit hermetic packaging. This technology uses the principle of resistance welding to melt the coating on the opposite side of the cover through the heat generated by the roller electrodes; Rolling up, the solder joints are formed one by one to form a fish-scale overlapping weld seam to realize the welding between the cover plate and the sealing ring of the ceramic or metal shell. This kind of welding belongs to local welding. When the welding current passes through the contact between the electrode and the cover plate, and the contact between the cover plate and the sealing ring, enough heat is generated to melt the plating...

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Problems solved by technology

[0005] The purpose of the present invention is to provide a parallel seam welding alloy cover plate for integrated circuit packaging and its preparation method, to solve the problem that the conventional parallel seam welding alloy cover plate adopts an integral electroless nickel plating process, and the thickness of the nickel plating layer formed on the surface is only A few microns make it difficult to avoid the exposure of the iron element in the substrate at the bottom of the coating during the parallel seam welding process, resulting in frequent rust failures in the salt spray test and bringing hidden dangers to the reliability of circuit applications

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