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Dimensionally-stable heat-conducting polytetrafluoroethylene sheet and preparation method thereof

A polytetrafluoroethylene and polytetrafluoroethylene resin technology is applied in the field of dimensionally stable thermally conductive polytetrafluoroethylene sheets and their preparation, and can solve the problem of affecting the insulation performance of materials, low thermal conductivity, and large thermal expansion coefficient of polytetrafluoroethylene resin. problem, to achieve the effect of good product performance, simple preparation process and easy operation

Inactive Publication Date: 2020-04-14
四川东方绝缘材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned prior art cannot solve the defects of high thermal expansion coefficient and low thermal conductivity of polytetrafluoroethylene resin at the same time, or the improvement of thermal conductivity affects the insulation performance of the material

Method used

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  • Dimensionally-stable heat-conducting polytetrafluoroethylene sheet and preparation method thereof
  • Dimensionally-stable heat-conducting polytetrafluoroethylene sheet and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～9

[0031] The basic process of preparing dimensionally stable thermally conductive PTFE sheets:

[0032] Preparation of mixed materials: Mix 100 parts by mass of spherical α-phase aluminum oxide powder with 5-10 parts by mass of fluorosilane coupling agent evenly, leave it for 24 hours, and then dry it in an oven at 240°C-260°C (temperature 1) for 1 ~ 2 hours (time 1), then pulverized into powder, made into 100 mesh surface treatment heat conduction powder material for subsequent use; The surface-treated heat-conducting powder material is uniformly mixed with 10-20wt% molding aids to form a mixed material, and stored at a temperature of 10°C-15°C for use;

[0033] Molding and sintering: place the mixture in an oven at 50°C to 60°C (temperature 2) for 12h to 24h (time 2) aging; then add the aged mixture to a temperature of 10°C to 15°C ( Temperature 3) in the mold, then increase the pressure to 25-50MPa (pressure 1) at a boosting speed of 5MPa / min, hold the pressure for 5-10min (...

Embodiment 10

[0044] A dimensionally stable heat-conducting polytetrafluoroethylene sheet is: according to the mass percentage of 40% polytetrafluoroethylene resin, 40% surface-treated heat-conducting powder material and 20% molding aids, polytetrafluoroethylene resin, surface-treated heat-conducting The mixed material prepared by mixing the powder material and the molding aid evenly is cured in an oven at a temperature of 50°C for 24h, and then molded and sintered in a film-making mold at a pressure of 25MPa and a temperature of 330°C, and then sintered at a temperature of 50°C / min. PTFE sheets with a thickness of 250 μm obtained by cooling down to room temperature at a cooling rate, that is, dimensionally stable and thermally conductive PTFE sheets;

[0045] The heat-conducting powder material for surface treatment is to mix 100 parts by mass of spherical α-phase aluminum oxide powder with 5 parts by mass of fluorosilane coupling agent evenly, place it for 24 hours, and then dry it in an o...

Embodiment 11

[0049] A dimensionally stable heat-conducting polytetrafluoroethylene sheet is: according to the mass percentage ratio of 50% polytetrafluoroethylene resin, 40% surface-treated heat-conducting powder material and 10% molding aid, polytetrafluoroethylene resin, surface-treated heat-conducting The mixed material prepared by mixing the powder material and the molding auxiliary agent evenly is cured in an oven at a temperature of 60°C for 12h, and then molded and sintered in a film-making mold at a pressure of 50MPa and a temperature of 370°C, and then sintered at a temperature of 50°C / min. PTFE sheets with a thickness of 500 μm obtained by cooling down to room temperature at a cooling rate, that is, dimensionally stable and thermally conductive PTFE sheets;

[0050] The surface-treated heat-conducting powder material is mixed uniformly with 100 parts by mass of spherical α-phase aluminum oxide powder and 10 parts by mass of fluorosilane coupling agent, left for 24 hours, and then ...

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Abstract

The invention discloses a dimensionally-stable heat-conducting polytetrafluoroethylene sheet and a preparation method thereof. The method is characterized by comprising the following steps: uniformlymixing following components in percentage by mass: 40%-50% of polytetrafluoroethylene resin, 40%-50% of a surface processed heat conduction powdery material and 10%-20% of a moulding aid to prepare amixed material, curing for 12-24 hours in a drying oven at a temperature of 50-60 DEG C; carrying out die pressing sintering in a film making die under a pressure of 25-50MPa at a temperature of 330-370 DEG C, and cooling to a room temperature at a cooling speed of 50 DEG C / min to obtain a polytetrafluoroethylene sheet with a thickness of 250-500 [mu]m, namely, the dimensionally-stable heat-conducting polytetrafluoroethylene sheet. The dimensionally-stable heat-conducting polytetrafluoroethylene sheet product has favorable properties, and can be used for preparing high-frequency high-speed copper-clad plates.

Description

technical field [0001] The invention belongs to the preparation of a polytetrafluoroethylene resin composite material and a sheet thereof, and relates to a size-stable heat-conducting polytetrafluoroethylene sheet and a preparation method thereof. The (prepared) dimensionally stable and heat-conducting polytetrafluoroethylene sheet of the invention is suitable for the preparation of high-frequency and high-speed copper-clad laminates. Background technique [0002] The application and popularization of 5G communication technology has put forward new high-frequency and high-speed technical performance requirements for copper clad laminates. PTFE is used to manufacture high-frequency and high-speed copper-clad laminates. Although it can meet the dielectric performance requirements of lower dielectric constant and dielectric loss, its thermal expansion coefficient is 12.8×10 -5 / °C (20°C~200°C), the requirements for dimensional stability of the copper clad laminate cannot be gu...

Claims

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Application Information

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IPC IPC(8): C08L27/18C08K9/06C08K7/18C08J5/18C09K5/14
CPCC08J5/18C08J2327/18C08K7/18C08K9/06C08K2201/003C08K2201/014C09K5/14
Inventor 王志娟唐荣芝张世明舒维周柯罗春明
Owner 四川东方绝缘材料股份有限公司
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