Wafer chamfering process

Abstract

The invention relates to the technical field of wafer machining, and discloses a wafer chamfering process based on a wafer chamfering device. The wafer chamfering device comprises a rotating piece, the rotating piece is connected with a chamfering wheel, the chamfering wheel is provided with a chamfering groove, and the opening direction of the chamfering groove is perpendicular to the axial direction of the chamfering wheel; the process comprises the following steps that S1, wafers are fed into the chamfering groove; S2: the radial direction of the wafers is at an acute angle with the openingdirection of the chamfered groove; S3, the rotating piece is started to gradually increase the rotating speed of the chamfering wheel, and after the rotating speed reaches a set driving rotating speed, the rotating speed is no longer increased; S4, when the rotating speed of the chamfering wheel is gradually increased, the rotating speed of the wafers is gradually increased, and after the rotating speed reaches the set wafer rotating speed, the rotating speed is no longer increased; and S5, the wafers rotate the acute angle in a reverse mode, and the radial direction of the wafers is parallelto the opening direction of the chamfering groove; and when the chamfering is conducted, the contact area between the wafers and the inner wall of the chamfering groove is reduced, the volume of theparts affected by the temperature change of the wafers is reduced, and the chamfering effect of the edge of the wafers is improved.

Description

technical field [0001] The invention relates to the technical field of wafer processing, more specifically, it relates to a wafer chamfering process. Background technique [0002] Wafer refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. Because of its circular shape, it is called wafer. Wafer is the carrier used in the production of integrated circuits. In general, wafers refer to single crystal silicon wafers. Single crystal silicon wafers are drawn and refined from ordinary silica sand, and are made into single crystal silicon rods through a series of measures of dissolution, purification and distillation. After the single crystal silicon rods are polished and sliced, they become wafers. [0003] After cutting, the edge surface of the silicon wafer has edges, corners, burrs, chipping, even cracks or other defects, and the edge surface is relatively rough. In order to increase the mechanical strength of the edge surface of the...

AI Technical Summary

Problems solved by technology

[0004] When the wafer is chamfered, the angle between its side and the chamfering groove of the chamfering device will not change. When the side of the wafer just contacts the inner wall of the chamfering groove, the force on the side of the wafer is the largest , due to the symmetry of the two sides of the side, the side of the wafer is not easy to be chamfered, and the friction time of the chamfer is long. After the internal temperature rises, the internal structure of the wafer will expand when heated, and it will shrink after chamfering, thus Make the chamfered edge not meet the standard requirements

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