Composite heat-dissipation material for semiconductor and preparation method thereof

Abstract

The invention belongs to the field of heat-conduction materials, and discloses a composite heat-dissipation material for a semiconductor and a preparation method thereof. The composite heat-dissipation material for the semiconductor comprises the following components in parts by weight: 90 to 100 parts of resin powder, 8 to 15 parts of hexagonal boron nitride, 13 to 17 parts of hollow aluminum oxide, 15 to 20 parts of nanometer activated carbon powder, 7 to 13 parts of a dispersing agent, 8 to 15 parts of an adhesive and 10 to 15 parts of expanded graphite. In the composite heat-dissipation material provided by the invention, the expanded graphite has rich pore structures and high thermal conductivity; pores of the expanded graphite can be fully filled with the nanometer activated carbon powder doped with the nanometer metal powder; the expanded graphite, the hollow aluminum oxide, the hexagonal boron nitride with high electrical insulation performance and the resin are applied to a semiconductor electronic device with high heat flux density to form an insulated high-heat-dissipation surface, so a heat-conduction medium with high heat conductivity is provided for the electronic device, and the problem of heat accumulation of an electronic device module can be solved.

Description

technical field [0001] The invention relates to the technical field of heat conducting materials, in particular to a composite heat dissipation material for semiconductors and a preparation method thereof. Background technique [0002] LED is a semiconductor light-emitting diode built on semiconductor transistors. With the development of technology and the extension of demand, the luminous flux and light efficiency of LEDs have been continuously improved. Power LEDs used in groups constitute high-power LED lighting sources and have been widely used in daily life. and in industrial production. In the actual environment, the LED chip modules used in groups are arranged in a certain form of array and welded on a special substrate. When the LED is working, heat will be generated, and the heat will be conducted to the heat dissipation fins of the lamp housing through the substrate to achieve the purpose of heat dissipation . However, both the LED heat dissipation substrate and ...

AI Technical Summary

Problems solved by technology

However, both the LED heat dissipation substrate and the heat dissipation fins of the lamp housing are solid materials, and there is an air gap between the contact surfaces. With the development of LEDs in the direction of high light intensity and high power, the problem of heat dissipation has become increasingly prominent

[0003] In addition to LEDs, electronic devices, especially high-power and miniaturized electronic components, will generate a lot of heat during the operation process. If the heat dissipation is not timely, the excessive heat accumulation will affect the normal operation of the components. Failure of electronic components and even lead to accidents