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Water-based cleaning agent for complex environment, and cleaning method

A water-based cleaning agent, a technology for complex environments, applied in detergent compositions, detergent compounding agents, chemical instruments and methods, etc. Remarkable cleaning effect, wide application range and simple preparation

Active Publication Date: 2020-04-21
CHONGQING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a water-based cleaning agent and a cleaning method for complex environments, so as to solve the problem that the existing cleaning agents are expensive, highly volatile, easy to burn, highly toxic, and harmful to work. Hazardous to personnel and also reacts with some metals

Method used

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  • Water-based cleaning agent for complex environment, and cleaning method
  • Water-based cleaning agent for complex environment, and cleaning method
  • Water-based cleaning agent for complex environment, and cleaning method

Examples

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preparation example Construction

[0041] A preparation method of a complex environment water-based cleaning agent, comprising the following steps:

[0042] Measure the raw materials of each component according to the composition and content ratio of the water-based cleaning agent in the aforementioned complex environment, add deionized water into the reaction kettle with a stirrer and start stirring, heat the reaction kettle, and keep the temperature at 30 At ±5°C, add surfactant, corrosion inhibitor and defoamer respectively, keep stirring until completely mixed, then stop stirring.

[0043] A method for cleaning complex environments with water-based cleaning agents, comprising the steps of:

[0044] 1) Use a water bath to heat the liquid medicine in a closed container to 25°C~40°C;

[0045] 2) Soak the pieces to be washed in the liquid medicine in step 1) for 20min~35min, and then put the pieces to be washed into the ultrasonic cleaning machine after soaking. The cleaning time is 10min~25min, and the cleani...

Embodiment 1

[0049] The composition of the water-based cleaning agent for complex environments is as follows: Surfactant accounts for 5% by weight, of which non-ionic surfactant:anionic surfactant=3:7, corrosion inhibitor 0.01%, defoamer 0.1%, and the balance for deionized water.

Embodiment 2

[0051] The composition of the water-based cleaning agent for complex environments is as follows: Surfactant accounts for 6% by weight, of which nonionic surfactant:anionic surfactant=7:15, corrosion inhibitor 0.05%, defoamer 0.12%, and the balance for deionized water.

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Abstract

The invention discloses a water-based cleaning agent for a complex environment, wherein the water-based cleaning agent is prepared from the following raw materials in percentage by weight: 3-12% of asurfactant, 0.01-0.25% of a corrosion inhibitor, 0.1-0.3% of a defoaming agent, and the balance of deionized water. According to the invention, the obtained water-based cleaning agent can rapidly andeffectively remove soldering flux residues and other pollutants on the surfaces of elements, is good in compatibility and wide in application range, and is particularly suitable for cleaning in complex environments such as high temperature, high acid, alkali, high oxidizability and the like; in a cleaning process, low foam, low volatility and low toxicity are achieved, the good cleaning effect isachieved, no residue exists on the surface after cleaning, and welding spots are bright; and the water-based cleaning agent is easy to prepare, the cleaning process is easy to operate, and the water-based cleaning agent can be used in cooperation with automatic spray cleaning and ultrasonic cleaning on the market.

Description

technical field [0001] The invention relates to the field of cleaning agent manufacturing after welding and assembly of circuits, in particular to a water-based cleaning agent and a cleaning method for complicated environments. Background technique [0002] In recent years, with the vigorous development of the domestic electronic information industry, the high density and high integration of packaging technology, and the emergence of three-dimensional packaging technology, Moore's Law was born, and the extremely small spacing difference makes the packaging requirements also change. be more stringent. A little flux residue and tiny particles and dust in the atmosphere may cause poor circuit contact, short circuit or even paralysis of the entire circuit, making small components unable to work normally, ranging from poor equipment operation to large industrial errors (such as Sensors, testers), or lead to other safety accidents. In order to avoid these situations and ensure t...

Claims

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Application Information

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IPC IPC(8): C11D1/83C11D3/60C11D3/04C11D3/28C11D3/37C11D11/00
CPCC11D1/83C11D3/046C11D3/28C11D3/3707C11D3/0026C11D1/66C11D1/667C11D1/72C11D1/74C11D1/24C11D2111/22
Inventor 甘贵生曹华东刘歆江兆琪陈仕琦许乾柱
Owner CHONGQING UNIV OF TECH