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Micron-sized pore deslagging method for epoxy substrate

An epoxy substrate, micron-level technology, applied in the processing of insulating substrates/layers, electrical components, printed circuit manufacturing, etc., can solve the problems of high production cost, inability to recycle the treatment liquid, not environmentally friendly, and long process. The effect of short process, low energy consumption in normal temperature operation, and simple ingredients

Active Publication Date: 2020-04-21
ZHEJIANG ZHENYOU ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned process has a long process, high production costs such as heating of each solution, consumption of reducing agents such as residual oxidants, and non-environmental protection problems that the treatment liquid cannot be recycled

Method used

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Examples

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Embodiment Construction

[0022] The following description is merely exemplary in nature and not intended to limit the disclosure, application or use. The specific implementation of the method for removing slag from micron-sized pores on epoxy substrates of the present invention will be further described below.

[0023] The present invention proposes a method for removing slag from micron-sized pores on an epoxy substrate, comprising the following steps:

[0024] 1. Configure the slag removal solution:

[0025] (1) Weigh the frosting powder with a particle size of D50=0.2mm, add it to DMI (1,3-dimethyl-2-imidazolinone) solvent, and make the first frosting powder with a solid content of 0.5%. slag;

[0026] (2) The second slag removal liquid is prepared from oxalic acid, hydrogen peroxide, and ethanol, with a pH range of 2, a hydrogen peroxide volume content of 5%, and an ethanol volume content of 30%.

[0027] 2. Specific operation process:

[0028] (1) Select 10 FR4 substrates after drilling, chec...

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Abstract

The invention relates to a micron-sized pore deslagging method for an epoxy substrate. The method comprises a first deslagging liquid and a second deslagging liquid, and specifically comprises the following deslagging steps: step 1, putting an epoxy substrate after drilling into the first deslagging liquid (submerging the epoxy substrate), carrying out ultrasonic assistance for 5-10 minutes, controlling the ultrasonic frequency to be 40 kHz and the power to be 100-200 W, and intermittently working for 15-30 seconds; after the ultrasonic treatment is finished, taking out the epoxy substrate, cleaning the surface of the epoxy substrate by using an elastic scraper or an air gun, and standing for 30 minutes; step 2, placing the epoxy substrate treated in the first step in a container with an air suction hood, spraying the second deslagging liquid till the epoxy substrate is submerged, performing ultrasonic assistance for 5-10 min, controlling the ultrasonic frequency to be 80-120 kHz and the power to be 100-200 W; and immediately taking out the epoxy substrate after the ultrasonic treatment is finished, oscillating and cleaning with clear water and drying. The components of the deslagging liquid are simple, easy to obtain and low in price; the operation process only comprises two steps so that the process is short; and normal temperature operation energy consumption is low. The first deslagging liquid can be recycled after being properly supplemented with raw materials, and the second deslagging liquid can also be supplemented and recycled after being filtered so that the method is environment-friendly and green.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board electroplating, and in particular relates to a method for removing slag from micron-sized pores of an epoxy substrate. Background technique [0002] Drilling is a process of PCB board making, and it is also a very important step. Drilling is to drill the required via holes on the copper clad laminate to provide electrical connection and fix the device. In the printed circuit board (referred to as PCB) processing and manufacturing process, affected by many factors such as materials, structural design, circuit design, pressing process and equipment, the PCB board processed by the pressing process will have a certain degree of deformation, which has a certain impact on drilling. Hole processing has a greater impact, such as drilling is prone to large burrs, hole position deviation, shift, alignment misalignment and other issues. The burrs will affect the post-process processing, and a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0055H05K2203/0769H05K2203/0779H05K2203/0783
Inventor 舒志华詹有根孟永立詹思汗潘青
Owner ZHEJIANG ZHENYOU ELECTRONICS CO LTD
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