Layout circuit board of multi-device parallel power module

Abstract

The invention discloses a layout circuit board of a multi-device parallel power module. In the layout circuit board of the multi-device parallel power module, a first lotus-shaped BNC interface (comprising a load positive electrode output terminal and a load negative electrode output terminal) is located in the center of a PCB, and a plurality of parallel silicon carbide devices in the silicon carbide device parallel module are arranged in a circumferential mode with the first lotus-shaped BNC interface as the circle center; and a plurality of parallel decoupling capacitors in a decoupling capacitor parallel module are arranged circumferentially by taking the first lotus-shaped BNC interface as a circle center. The arrangement positions of the parallel devices are optimized, so that parasitic parameters of the circuit are matched, the distribution difference of stray inductance of the circuit is reduced, the current coupling effect is eliminated, the transient current imbalance of themulti-device parallel power module can be changed, and the good current sharing characteristic of the parallel silicon carbide devices is realized.

Description

technical field [0001] The invention relates to the technical field of multi-device parallel connection current sharing, in particular to a layout circuit board of a multi-device parallel connection power module. Background technique [0002] With increasing requirements in terms of efficiency, power density, reliability and maintenance, large capacity converters are becoming more and more popular. Silicon carbide majority carrier device technology is gradually maturing, which can eliminate the limitations of silicon material device switching technology, and is gradually applied to high-density and high-efficiency power converters. Due to the trade-off between current rating and chip cost, the current rating of a single commercial silicon carbide chip is usually limited to tens of amps, and the limited current capacity poses challenges for high-current applications of silicon carbide devices. In order to increase the current capability, parallel multi-device power modules a...

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Problems solved by technology

[0003] The purpose of the present invention is to provide a layout circuit board of a multi-device parallel power module to solve the problem of current coupling effect in the direct copper layout mode adopted by the traditional silicon carbide parallel power module, resulting in aggravated transient current imbalance

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