Dicing solution for gold electrode chips

Abstract

The invention discloses a dicing liquid for gold electrode chips, which is prepared by selecting non-foaming amphoteric surfactant, ethylenediamine ethoxypropoxylate, polyethylene glycol 10000 and water, which not only has dynamic wetting ability It is strong, can quickly wet the blade and cutting channel, and has extremely low foam and fast defoaming. At the same time, because ethylenediamine ethoxypropoxylate has a rich branched chain structure, it forms a local short-range steric hindrance in the solution. It can be filled in the basic frame built by polyethylene glycol, which can significantly improve the steric hindrance density of the solution, enhance the suspension and dispersion ability of the cutting powder, avoid the adhesion of the cutting powder on the chip, and ensure the quality of the slice.

Description

technical field [0001] The invention belongs to the field of semiconductor device manufacturing, and in particular relates to a dicing solution for gold electrode chips with little foam, easy disappearance and good powder suspending property. Background technique [0002] Semiconductor devices are made through the main links of integrated circuit design, chip manufacturing and packaging. Chip manufacturing is to mass-produce multiple independent units with the same structure on the wafer at the same time, and cut them with a blade before packaging to separate the independent units from each other, and then package functional individuals. When the blade cuts the chip, it needs to match the dicing fluid. One of the purposes is to lubricate and cool the interface when the blade and the chip are rubbed, reduce the wear of the blade, reduce the heat generated and accelerate the heat conduction; the other purpose is to disperse the cutting powder and prevent the powder Stick on. ...

AI Technical Summary

Problems solved by technology

[0003] Some of the existing dicing fluids are made of organic silicon or phosphate ester surfactants, but these surfactants are rich in foam, and the continuous accumulation of foam will reduce the amount of subsequent surfactants adsorbed on the blade and cutting road, making The production rate of cutting powder increases rapidly, making it difficult to guarantee the cutting quality; at the same time, foam accumulation tends to overflow the tank, polluting the machine and ultra-clean production site

Some scribing solutions use polyvinyl alcohol or polyethylene glycol to provide suspension and dispersion functions, but because polyvinyl alcohol and polyethylene glycol are straight chain structures, the random distribution in the solution makes it only the basis for building a spatial network structure Frame, small steric hindrance density, short-range local aggregation of cutting powder leads to insufficient suspension and dispersion ability, and sometimes the powder adheres to the chip

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