Thermocuring and UV curing composite adhesive and preparation method thereof

A thermal curing, compound adhesive technology, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve the problem that the compound strength does not meet the product performance requirements, and can solve the replacement problem and ensure the use requirements. Effect

Inactive Publication Date: 2020-05-12
JIANGSU JINGHONG NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the existing solvent-free composite glue and UV composite glue are solvent-free products, their composite strength cannot meet the performance requirements of the product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A heat-curable and UV-curable composite adhesive, which includes the following raw materials in percentage by weight: 15 parts of polyurethane acrylic resin, 10 parts of tetrahydrofuryl methacrylate, 15 parts of isobornyl methacrylate, 1-hydroxycyclohexyl 2 parts of phenyl ketone, 2 parts of 2,4-diethylthioxanthone, 1 part of benzoin dimethyl ether, 4 parts of adhesion promoter, 0.5 part of leveling agent, 0.5 part of defoamer, NCO-terminated polyurethane 20 parts of acrylate, 30 parts of OH-terminated acrylate oligomer.

[0030] The preparation method of described a kind of thermosetting type and UV curing composite glue specifically comprises the following steps:

[0031] Add polyurethane acrylic resin, OH-terminated acrylate oligomer, tetrahydrofuryl methacrylate, isobornyl methacrylate, 1-hydroxycyclohexyl phenyl ketone, 2,4-diethylthioxanthene in parts by weight Ketone, benzoin dimethyl ether, adhesion promoter, leveling agent, defoamer. Stir well at room tempera...

Embodiment 2

[0034] A kind of thermosetting type and UV curing compound glue, it comprises the raw material of following percentage by weight: 20 parts of urethane acrylic resins, 10 parts of 2-phenoxyethyl methacrylates, 15 parts of methacrylate phosphates, 1 - 4 parts of hydroxycyclohexyl phenyl ketone, 1 part of benzoin dimethyl ether, 4 parts of adhesion promoter, 0.5 parts of leveling agent, 0.5 parts of defoamer, 15 parts of NCO-terminated polyurethane acrylate, 15 parts of terminal OH acrylate Polymer 30 parts.

[0035] The preparation method of described a kind of thermosetting type and UV curing composite glue specifically comprises the following steps:

[0036] Add polyurethane acrylic resin, OH terminal acrylate oligomer, 2-phenoxyethyl methacrylate, isobornyl methacrylate, 1-hydroxycyclohexyl phenyl ketone, benzoin dimethyl ether, Adhesion promoter, leveling agent, defoamer. Stir well at room temperature. Store in a sealed and dark place at low temperature. When in use, add ...

Embodiment 3

[0039] A heat-curable and UV-curable composite adhesive, which includes the following raw materials in percentage by weight: 25 parts of polyurethane acrylic resin, 15 parts of methyl acrylate, 10 parts of isobornyl methacrylate, sulfonic acid thioxanthone 2 parts, 2 parts of 2,4-diethylthioxanthone, 1 part of benzoin dimethyl ether, 4 parts of adhesion promoter, 0.5 parts of leveling agent, 0.5 parts of defoamer, 20 parts of NCO-terminated polyurethane acrylate , 20 parts of OH-terminated acrylate oligomers.

[0040] The preparation method of described a kind of thermosetting type and UV curing composite glue specifically comprises the following steps:

[0041] Add polyurethane acrylic resin, OH-terminated acrylate oligomer, tetrahydrofuryl methacrylate, isobornyl methacrylate, sulfothioxanthone, 2,4-diethylthioxanthone by weight, Benzoin dimethyl ether, adhesion promoter, leveling agent, defoamer. Stir well at room temperature. Store in a sealed and dark place at low temp...

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Abstract

The formula of a thermocuring and UV curing composite adhesive comprises the following components (by weight): 20-40 parts of modified acrylate, 20-40 parts of NCO-terminated urethane acrylate, 20-30parts of an acrylate monomer, 4-6 parts of a photoinitiator, 0.2-1 part of a photosensitizer, 4-6 parts of an additive and 20-50 parts of OH-terminated acrylate or OH-terminated acrylate oligomer. A preparation method comprises the following steps: (1) adding the modified acrylate, the OH-terminated acrylate or OH-terminated acrylate oligomer, the acrylate monomer, the photoinitiator, the photosensitizer and the additive into a reaction kettle in parts by weight, and uniformly stirring at room temperature; and (2) sealing and storing in a dark place at a low temperature, adding NCO-terminatedurethane acrylate during use, and uniformly stirring to obtain the thermocuring and UV-curing composite adhesive. According to the composite adhesive disclosed by the invention, the peel strength of acomposite film can reach 10N/25mm, the replacement problem of a solvent type composite adhesive is solved, and the use requirements of the composite film can be ensured.

Description

technical field [0001] The invention relates to the technical field of UV composite glue, in particular to a thermosetting and UV curing composite glue and a preparation method thereof. Background technique [0002] At present, most of the composite adhesives used in flexible packaging are solvent-based products, which bring certain pressure to environmental protection. Although the existing solvent-free composite glue and UV composite glue are solvent-free products, their composite strength cannot meet the performance requirements of the product. Contents of the invention [0003] Aiming at the problems in the background technology, the present invention provides a heat-curing and UV-curing composite adhesive and its preparation method. On the basis of UV curing, NCO groups and OH groups are introduced into the molecular chain, and heated at 45 ° C. The case produces post-curing effects. The product has moderate viscosity and is easy to process, which can greatly improv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14
CPCC08L2205/025C09J175/14C08L75/14
Inventor 徐学凯吴培龙吴松陆银秋万灵书
Owner JIANGSU JINGHONG NEW MATERIAL TECH
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