Flexible stretchable circuit and manufacturing method thereof
A manufacturing method and flexible technology, applied in the field of electronics, can solve problems such as inability to meet high-strength stretching
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Embodiment 1
[0067] low melting point metal Gallium Indium Eutectic Alloy (melting point 15.9°C) Hard Substrate PVC film flexible stretchable substrate PBAT film (glass transition temperature -120°C) first environment Temperature -120℃, treatment time 40min second environment Temperature -20°C, treatment time 4h third environment Temperature 20℃, treatment time 20min
Embodiment 2
[0069] low melting point metal Gallium-tin eutectic alloy (melting point 20.4°C) Hard Substrate PVC film flexible stretchable substrate Addition type silica gel membrane (glass transition temperature -170°C) first environment Temperature -180°C, treatment time 40min second environment Temperature -20℃, treatment time 6h third environment Temperature 30℃, treatment time 20min
Embodiment 3
[0071] low melting point metal Gallium Indium Tin Eutectic Alloy (melting point 11°C) Hard Substrate PET film flexible stretchable substrate TPU film (glass transition temperature -140°C) first environment Temperature -150℃, treatment time 10min second environment Temperature -30℃, treatment time 3h third environment Temperature 20℃, treatment time 20min
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