Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Bonding sheet and preparation method thereof

A bonding sheet, high thermal conductivity technology, applied in the direction of adhesive, adhesive type, film/sheet release liner, etc., can solve the problem of low modulus, etc.

Active Publication Date: 2020-05-19
ZHEJIANG WAZAM NEW MATERIAL CO LTD +1
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

High thermal conductivity can conduct the heat generated by components in time to ensure that the operating temperature of electronic products will not be too high; high elasticity and low modulus characteristics solve the problem of brittle cracking after curing of traditional high thermal conductivity adhesive sheets, and can be absorbed in time Stress caused by long-term thermal expansion and contraction of materials ensures the stability of electronic products

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bonding sheet and preparation method thereof
  • Bonding sheet and preparation method thereof
  • Bonding sheet and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Step (1) 30Wt%N, N-dimethylformamide+50Wt% ethyl ketone solvent solvent combination, 1.8Wt% dicyandiamide curing agent, 70Wt% bisphenol F, 22Wt% organosilicon epoxy resin , 13Wt% carboxy-terminated nitrile rubber, 0.4Wt% surface additives are mixed and stirred to obtain pure rubber combination;

[0034] Step (2): Add 550Wt% of the high thermal conductivity powder combination into the pure rubber combination of the step (1); respectively go through 1500 rpm high-speed shear stirring, 500 rpm + forward rotation and reverse rotation for 30 minutes respectively Zirconia ball milling, 400 rpm low-speed defoaming and other steps to obtain uniformly dispersed high thermal conductivity glue;

[0035] Step (3): Coat the high thermal conductivity glue in the step (2) on a 50 μm release film through a wire rod of a specific specification, let it stand at room temperature for 3 minutes, put it in an oven at 160°C for 5 minutes and bake it Drying and pre-curing to obtain a 100μm ad...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thermal conductivityaaaaaaaaaa
Login to View More

Abstract

The invention discloses a bonding sheet and a preparation method thereof. The bonding sheet is formed by coating a release film with an epoxy-modified high-thermal-conductivity glue solution and thendrying. The high-thermal-conductivity glue solution comprises the following components in parts by weight: 500-700 parts of a high-thermal-conductivity powder, 15-80 parts of epoxy resin A, 20-50 parts of epoxy modified organic silicon resin, 5-15 parts of modified rubber, 1-15 parts of a curing agent, 0.1-0.7 part of a surface additive and 70-100 parts of a solvent. The bonding sheet of the present invention has both excellent high thermal conductivity and high elasticity, and low modulus characteristics.

Description

technical field [0001] The invention belongs to the technical field of manufacturing metal copper-clad laminates, and in particular relates to an adhesive sheet and a preparation method thereof. Background technique [0002] Due to its excellent heat dissipation capability, metal-based copper-clad laminates have gradually become the main raw material for heat-dissipating PCBs. Especially in recent years, with the high integration and high power of electronic circuits, the heat generated by electronic products has also increased sharply, making PCB manufacturers put forward higher and higher requirements for the heat dissipation capacity of metal-based copper clad laminates. [0003] At the same time, electronic product terminals have increasingly stringent requirements on the reliability of materials. Among them, problems such as solder pin drop-off and pad cracking in components have attracted more and more attention, especially for high-thermal-conductivity metal-based cop...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J163/00C09J183/04C09J11/04C09J7/40C09J7/30
CPCC08K2003/2227C08K2003/282C08K2003/385C08K2201/005C08L2201/08C08L2203/20C08L2205/03C09J11/04C09J163/00C09J183/04C09J2203/326C09J7/30C09J7/40C08L83/04C08K3/22C08K3/28C08K3/38C08L63/00
Inventor 应雄锋沈宗华沈丹洋吕迅凯
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com