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An integrated bionic liquid-absorbing core for loop heat pipe, preparation method and application

A loop heat pipe, integrated technology, used in lighting and heating equipment, additive manufacturing, indirect heat exchangers, etc., can solve the problems of contradictory capillary suction performance and permeability, and poor anti-gravity operation performance of loop heat pipes.

Active Publication Date: 2021-04-20
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to overcome the deficiencies of the prior art, to provide an integrated bionic liquid-absorbent core for loop heat pipes, its preparation method and application, which solves the problem of the interaction between capillary suction performance and permeability in the above-mentioned background technology. Contradictions, the problem of poor anti-gravity performance of the loop heat pipe

Method used

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  • An integrated bionic liquid-absorbing core for loop heat pipe, preparation method and application
  • An integrated bionic liquid-absorbing core for loop heat pipe, preparation method and application
  • An integrated bionic liquid-absorbing core for loop heat pipe, preparation method and application

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Embodiment 1

[0029] Such as figure 2 , an integrated bionic liquid-absorbing wick 1 for a loop heat pipe according to this embodiment, comprising a porous structure substrate 2, a liquid compensation chamber 1-1 and a capillary suction channel 1-2;

[0030] The liquid compensation chamber 1-1 and the capillary suction channel 1-2 are arranged in the base body 2, the liquid compensation chamber 1-1 is provided with a liquid inlet 4-1, and is connected to the capillary suction channel 1 at the downstream port of the liquid compensation chamber. -2 connected, the downstream port of the capillary suction channel 1-2 is a steam outlet;

[0031] In this embodiment, the liquid compensation chamber 1-1 and the capillary suction channel 1-2 are arranged in multiple stages, with the channel where the liquid inlet 4-1 is located as the first-stage channel 3-1, forming a tree branched along the liquid flow direction. A network-like multi-level bionic channel 3, the first to fourth-level channels (3-...

Embodiment 2

[0036] This embodiment provides a method for preparing an integrated bionic liquid-absorbing core 1, and the porous structure matrix 2 is manufactured by combining powder sintering technology and 3D printing technology. First, design the parameters of the multi-level bionic channel 3 according to the requirements, use alumina powder as the raw material, and use selective laser sintering 3D printing technology to manufacture the solid structure of the multi-level bionic channel 3, and use this as the core to put it into the powder sintering mold In the process, red copper powder is filled, the powder sintering mold is put into a sintering furnace together with the core of the multi-level bionic channel 3 for sintering, and finally the multi-level bionic channel 3 is dissolved with a strong alkali solution of sodium hydroxide to obtain a multi-level bionic channel 3 The porous structure of the matrix 2.

Embodiment 3

[0038] This embodiment provides a method for preparing an integrated bionic liquid-absorbing core 1 , using selective laser sintering 3D printing technology to manufacture the porous structure matrix 2 of the liquid-absorbing core 1 . Design the overall model of the integrated liquid-absorbing core 1 with multi-level bionic channels 3, and import the model into the 3D printer, select copper powder as the raw material, and adjust the laser power, scanning time and scanning time by selecting the process parameters of 3D printing. The path melts the surface of the powder, the part of the powder and the surface of the powder are connected to form a sintering neck, and micro pores are formed between multiple powders. Through this method, a porous structure matrix 2 with a pore structure can be formed, and the multi-level biomimetic channel 3 inside it can be obtained by automatically forming a scanning pattern by a 3D printer according to the model structure. This embodiment is dir...

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Abstract

The invention discloses an integrated bionic liquid-absorbing core for a loop heat pipe, a preparation method and an application. The integrated bionic liquid-absorbing core includes a base body, a liquid compensation chamber and a capillary suction channel; the liquid compensation chamber is provided with a liquid inlet, and communicates with the capillary suction channel at the downstream port of the liquid compensation chamber, and the downstream of the capillary suction channel The port is a steam outlet; the liquid compensation chamber and the capillary suction channel are arranged in multiple levels to form a tree-like multi-level bionic channel, and the diameter satisfies Murray's law. The preparation of the integrated bionic liquid-absorbing core combines selective laser sintering 3D printing technology, and the preparation process is simple and convenient. The invention integrates the liquid-absorbing core and the liquid compensation chamber, and connects them through a multi-stage bionic channel based on Murray's law. When applied to a loop heat pipe, it can ensure that the liquid-absorbing core has a large capillary suction force and reduce the liquid labor cost. It has low mass flow resistance and excellent anti-gravity running performance, so it has a good application prospect.

Description

technical field [0001] The invention relates to an integrated bionic liquid-absorbing core for a loop heat pipe, a preparation method and an application. Background technique [0002] With the rapid development of microelectronics technology, electronic products tend to be high-performance, high-power, portable, and miniaturized. The miniaturization and integration of high-performance microprocessors, high-power LEDs, high-power solid-state lasers and other microelectronic / optoelectronic chips and their application systems, the rising heat intensity per unit area of ​​the chip leads to the fatal problem of high heat flux in a small space, which directly affects Cost, performance and reliability of electronic devices. According to the development trend of electronic chip heat dissipation predicted by the American Electronics Manufacturing Promotion Association in 2002, the heat flux density of high-performance microprocessors has reached 100W / cm 2 ; The heat flux density of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/04B22F3/105B22F5/10B33Y10/00B33Y80/00F21V29/51
CPCF28D15/046B22F5/10B33Y10/00B33Y80/00F21V29/51B22F2005/103B22F10/00B22F10/28Y02P10/25
Inventor 周伟凌伟淞刘成忠刘瑞亮黄家乐
Owner XIAMEN UNIV
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