The invention relates to a via hole
pitch parameter calculation method,
computer equipment, a medium and a product. The calculation method comprises the following steps of: obtaining
netlist structure information in the design of the super-large-scale
integrated circuit, and filtering disconnected parts of a line net and parts where no current passes actually; starting from an input pin of each line network, searching for
interconnection lines and via holes in contact with the line network, marking an initial node, recording the position of a contact point, and recursively searching for the associated
interconnection lines or via holes until returning to an output pin of the line network; according to the central point positions of the
interconnection lines and the via holes and the
metal layer where the interconnection lines are located, the relative connection relation between the interconnection lines and the via holes is determined, and a tree-shaped
network structure is constructed; constructing a virtual interconnection line; and performing bidirectional traversal on any intermediate node of the
tree network structure, traversing all nodes in the path upwards and downwards along the
tree network structure, and calculating the sum of the distances among all via hole nodes in the traversal path to obtain the via hole
pitch.