This invention discloses a miniaturized,
highly selective bandpass filter
chip for
multipath transmission, comprising an input port, an output port, a port matching network, five octagonal inductors (L1~L5), seven MIM capacitors (C1~C7), and one ground
inductor Ls1. It includes a conventional filtering path (Path A) and a compact
coupling path (Path B) connected in parallel between the input and output ports. The port matching network is composed of capacitors C4 and C7. Path A forms three resonant units by connecting capacitors C1~C3 in parallel with inductors L1~L3, which, together with
capacitor C5,
inductor L4, and ground
inductor Ls1, constitute a basic bandpass structure and generate low-frequency
transmission zeros. Path B forms a compact
coupling network by connecting symmetrically coupled inductor L5 in parallel with
capacitor C6, utilizing mutual
inductance coupling to generate additional high-frequency
transmission zeros. The filter
chip is implemented using GaAs-based IPD technology to achieve fully lumped component integration, possessing advantages such as compact structure,
high selectivity, stable performance, and high integration density.