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Surface acoustic wave transducer with transverse mode suppression function and preparation method thereof

A surface acoustic wave and transducer technology, applied in electrical components, impedance networks, etc., can solve the problems of increasing the insertion loss of SAW devices, affecting the performance of SAW devices, and large insertion loss, achieving easy large-scale promotion, performance improvement, The effect of in-band fluctuation reduction

Active Publication Date: 2020-05-26
SHOULDER ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the electro-acoustic transducers currently adopting traditional designs have disadvantages such as large in-band fluctuations, large insertion loss, poor squareness coefficient, low quality factor, and serious clutter interference.
One of the problems with SAW transducers is that while the main mode is excited, unnecessary transverse modes are also generated. These transverse modes will generate spurious responses, increase the insertion loss of the SAW device, and cause fluctuations in the passband. Affect the performance of SAW devices

Method used

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  • Surface acoustic wave transducer with transverse mode suppression function and preparation method thereof
  • Surface acoustic wave transducer with transverse mode suppression function and preparation method thereof
  • Surface acoustic wave transducer with transverse mode suppression function and preparation method thereof

Examples

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Embodiment 1

[0037] A method for preparing a surface acoustic wave transducer with a transverse mode suppression function, comprising the steps of:

[0038]Step 1. Obtain the piezoelectric substrate 1 and clean the surface. Piezoelectric substrate 1 uses 128°YX-LiNbO with high electromechanical coupling coefficient 3 wafer.

[0039] Step 2, preparing an interdigital transducer on the piezoelectric substrate 1 by photolithography, evaporation, stripping and other processes.

[0040] Specifically, combine Figure 1-Figure 2 As shown, the interdigital transducer includes a first interdigital electrode 2 and a second interdigital electrode 3 that are oppositely arranged, and a first bus bar 4 connected to the comb handle of the first interdigital electrode 2 and connected to the second interdigital electrode. The second bus bar 5 connected to the comb handle of the interdigital electrode 3 , each interdigital electrode is respectively placed between two adjacent electrode fingers of another...

Embodiment 2

[0046] A method for preparing another surface acoustic wave transducer with a transverse mode suppression function, comprising the following steps:

[0047] Step 1. Obtain the piezoelectric substrate 1 and clean the surface. A 36° quartz wafer with a high electromechanical coupling coefficient is used for the piezoelectric substrate 1 .

[0048] Step 2, preparing an interdigital transducer on the piezoelectric substrate 1 through processes such as evaporation, photolithography, and corrosion.

[0049] Specifically, combine Figure 3-Figure 4 As shown, the interdigital transducer includes a first interdigital electrode 2 and a second interdigital electrode 3 that are oppositely arranged, and a first bus bar 4 connected to the comb handle of the first interdigital electrode 2 and connected to the second interdigital electrode. The second bus bar 5 connected to the comb handle of the interdigital electrode 3 , each interdigital electrode is respectively placed between two adjac...

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Abstract

The invention discloses a surface acoustic wave transducer with a transverse mode suppression function and a preparation method thereof. The invention relates to the field of surface acoustic wave devices and manufacturing thereof. The structure comprises a piezoelectric substrate and an interdigital transducer arranged on the piezoelectric substrate. The interdigital transducer comprises a firstinterdigital electrode, a second interdigital electrode, a first bus bar and a second bus bar, wherein the first interdigital electrode and the second interdigital electrode are crossed. According tothe structure of the interdigital transducer, the interdigital transducer is further divided into an interdigital region, a first single-finger region and a second single-finger region; grooves are formed in interdigital gaps between adjacent interdigital electrodes in the interdigital region, and the grooves are located in the interdigital regions at the junctions of the interdigital region and the edges of the first single-finger region and the second single-finger region respectively; by forming the grooves, the sound velocity of the edge of the interdigital region of the surface acoustic wave transducer is lower than that of the center of the interdigital region, and the sound velocity of the first single-finger region and the second single-finger region is higher than that of the center of the interdigital region, so that the transverse wave mode of sound waves can be effectively inhibited; clutter response is inhibited; and the performance of the surface acoustic wave transduceris greatly improved.

Description

technical field [0001] The invention relates to the field of surface acoustic wave devices and their manufacture, in particular to a surface acoustic wave resonator or filter required for signal processing of wireless communication equipment, specifically a surface acoustic wave resonator with a transverse mode suppression function Wave transducer and method of making the same. Background technique [0002] Surface Acoustic Wave (SAW) technology is a radio frequency electronic discipline that combines acoustics, electronics, piezoelectric materials and semiconductor planar technology. Since the SAW transducer works in the radio frequency band, the SAW transducer has the unique advantages of low electro-acoustic conversion loss, flexible design and easy fabrication, so it is widely used and is an important part of various SAW devices. [0003] With the continuous expansion of the application range and the rapid development of communication technology, SAW devices are used mo...

Claims

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Application Information

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IPC IPC(8): H03H9/64H03H3/08
CPCH03H9/6489H03H3/08
Inventor 王为标陆增天毛宏庆
Owner SHOULDER ELECTRONICS CO LTD
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