Redistribution layer structure and manufacturing method thereof

Abstract

The invention provides a redistribution layer structure. The redistribution layer structure comprises a substrate, a connecting pad, a dielectric layer, a self-alignment structure, a conductive layerand a conductive connecting piece; the connecting pad is disposed on the substrate; the dielectric layer is disposed on the substrate and exposes a portion of the connecting pad; the self-alignment structure is disposed on the dielectric layer; the conductive layer extends from the connecting pad and conformally covers the surface of the self-alignment structure; the conductive connecting piece isconfigured on the self-alignment structure. The invention further provides a manufacturing method of the redistribution layer structure.

Description

technical field [0001] The invention relates to a semiconductor structure and a manufacturing method thereof, in particular to a rewiring layer structure and a manufacturing method thereof. Background technique [0002] In recent years, due to the increasing integration of various electronic components (such as transistors, diodes, resistors, capacitors, etc.), the semiconductor industry has grown rapidly. This increase in integration is mostly due to the continuous shrinking of the minimum feature size, allowing more components to be integrated in a specific area. [0003] Compared with conventional packaging structures, these smaller electronic components have smaller areas and thus require smaller packaging structures. For example, a semiconductor chip or die has more and more input / output (I / O) pads, and a redistribution layer (redistribution layer, RDL) can replace the original I / O pads of the semiconductor chip or die. Locations are relocated around the semiconductor...

AI Technical Summary

Problems solved by technology

[0004] However, in the traditional wafer-level packaging process, the under-ball metallurgy (UBM) layer has a nearly planar structure, so that the contact area between the UBM layer and the solder ball is small and the bonding force is weak, which leads to the solder ball Delamination or generation of intermetallic compound (IMC) problems

In addition, the abnormal ball height of the solder balls is also likely to cause problems of cold joints or solder bridges during the packaging process.

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