35results about How to "Improve business competitiveness" patented technology

A method for manufacturing a bonded wafer with ultra-thin single crystal ferroelectric film is provided, comprising the following steps: providing a single crystal ferroelectric wafer and a carrier wafer while activating the surfaces of the single crystal ferroelectric wafer and the carrier wafer; bonding the activated surface of the single crystal ferroelectric wafer to the activated surface of the carrier wafer; and thinning the single crystal ferroelectric wafer for forming an ultra-thin single crystal ferroelectric film. Wherein, the thinning process in the aforesaid preferred embodiment is the method of polishing, grinding, chemical mechanical polishing, or etching. And the bonding force generated in the bonding process is strong enough to resist the shearing force.

The present invention discloses a method of manufacturing a foam body having an anisotropic cell structure, the method comprising the steps of: expanding a polymer at an elevated temperature to form an initial foam body; and cooling the initial foam body under a negative pressure. There is also provided a method of manufacturing a foam body having an anisotropic cell structure, the method comprising the steps of: (a) in a first expansion step, expanding a foamable polymer composition substantially isotropically to form an initial foam body having an isotropic cell structure; and (b) in a second expansion step, expanding the initial foam body anisotropically in a selected direction under a negative pressure which applies an expanding force in the selected direction to provide a final foam body having an anisotropic cell structure. Apparatus for the methods are also disclosed.

A method of manufacturing a foam body having an anisotropic cell structure, the method including the steps of: expanding a polymer at an elevated temperature to form an initial foam body; and cooling the initial foam body under a negative pressure. There is also provided a method of manufacturing a foam body having an anisotropic cell structure, the method including the steps of: (a) in a first expansion step, expanding a foamable polymer composition substantially isotropically to form an initial foam body having an isotropic cell structure; and (b) in a second expansion step, expanding the initial foam body anisotropically in a selected direction under a negative pressure which applies an expanding force in the selected direction to provide a final foam body having an anisotropic cell structure. Apparatus for the methods are also disclosed.

The embodiment of the invention discloses an implementation method of Karaoke service based on an IPTV (Internet Protocol Television) system. After a first terminal and a second terminal form Karaoke connection, a service terminal establishes a play list and sends the play list to the first terminal and the second terminal; when the first terminal and / or the second terminal start(s) the play list, a server terminal synchronously sends media stream to the first terminal and the second terminal; the first terminal collects first audio stream of a song of a local terminal user in real time to be subjected to audio mixing playing with the media stream sent by the server terminal, and sends the first audio stream to the second terminal to be subjected to audio mixing playing with the media stream sent by the server terminal; and the second terminal collects second audio stream of the song of the local terminal user in real time to be subjected to audio mixing playing with the media stream sent by the server terminal, and sends the second audio stream to the first terminal to be subjected to audio mixing playing with the media stream sent by the server terminal. The embodiment of the invention also discloses a terminal, the server terminal and an IPTV (Internet Protocol Television) system. The invention can realize remote Karaoke interaction (such as chorus and the like).

Provided is a circuit structure including a substrate, a pad, a dielectric layer, a conductive layer, an adhesion layer, and a conductive bump. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The conductive layer contacts the pad and extends from the pad to cover a top surface of the dielectric layer. The adhesion layer is disposed between the dielectric layer and the conductive layer. The conductive bump extends in an upward manner from a top surface of the conductive layer. The conductive bump and the conductive layer are integrally formed. A method of manufacturing the circuit structure is also provided.