Organosilicon composition, reaction product, and preparation method and application of reaction product
A technology of reaction products and compositions, used in adhesive additives, non-polymer adhesive additives, coatings, etc.
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Embodiment 1
[0053] The photocurable silicone in this embodiment is prepared according to the following method:
[0054] (1) The linear polysiloxane containing H in the side group is used as a raw material, mixed evenly with the siloxane of the structure shown in the formula (I) and 4wt% photoinitiator 1173; the unsaturated polysiloxane shown in the formula (I) Hydrocarbyl compounds, R 1 for vinyl, R 2 , B 1 , B 2 , B 3 , B 4 Both are methyl, Z 1 ,Z 2 Both - OSiPh(Me) 2 , n is 5; the molar ratio of Si-H in the linear polysiloxane containing H in the side group to the vinyl group in the siloxane of the structure shown in formula (I) is 1.4:1;
[0055] (2) UV-cure the mixture of step (1) under the protection of an inert gas, the UV wavelength is 280nm, and the light intensity is 50 μW / cm 2 ;, the reaction time is 5min, and the photocurable silicone with a curing depth of 50nm is prepared.
Embodiment 2
[0057] On the basis of embodiment 1, the present embodiment is different in that: R 1 For ethynyl groups, 2 wt% antioxidant Irganox-1010 was added to the mixture, and other conditions remained unchanged, to obtain a photocurable silicone with a curing depth of 80 nm.
Embodiment 3
[0059] This example is based on Example 2, with the difference that 8 wt% of the defoamer BASF A10 is added to the mixture, and other conditions remain unchanged, to obtain a photocurable silicone with a curing depth of 100 nm.
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