Three-dimensional MEMS structure metal filling method based on powder sintering process

Abstract

The invention discloses a three-dimensional MEMS structure metal filling method based on a powder sintering process, and belongs to the field of high-precision electronic machinery. A three-dimensional MEMS structure is filled with metal powder and then sintered in the protective gas atmosphere, no liquid environment exists in the whole technological process, the possible influences of instabilityof liquid and generation of bubbles on the micron-scale structure are avoided to the maximum extent, and the filling effect is good; meanwhile, the technological process is simple, compared with a traditional electroplating technology, the time is greatly shortened, the efficiency is improved, the method is suitable for batch production, and therefore productivity is improved. The method has lowrequirements on the shape of the structure, especially aspect ratio, can be flexibly applied to the high aspect ratio structure which cannot be realized by electroplating, and improves compatibility.

Description

technical field [0001] The invention relates to the field of high-precision electronic machinery, in particular to a three-dimensional MEMS structure metal filling method based on a powder sintering process. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS, Micro-Electro-Mechanical System), also known as micro-electro-mechanical systems, micro-systems, micro-machines, etc., refers to high-tech devices with a size of a few millimeters or even smaller. MEMS is an independent intelligent system whose internal structure is generally on the order of microns or even nanometers. The MEMS process has the characteristics of high precision, small size, and is suitable for mass production. It is widely used in high-precision electromechanical equipment, and the three-dimensional MEMS structure can make full use of the space in the vertical direction of the substrate and increase the power density of the device. Therefore, in Implementing electrical interconnections...

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Problems solved by technology

[0012] 1. The instability of the wet environment of the electroplating solution may affect the device, and once the bubbles that may appear in the electroplating process enter the structure, it will inevitably affect the effect of the electrical connection; 2. There are certain requirements for the structure size, Difficult to achieve high aspect ratio filling; 3. Time-consuming and difficult to achieve mass production

The fastest electroplating rate is 1000μm / 45h, which will greatly reduce production efficiency

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