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Polybutylene terephthalate composition and preparation method thereof

A technology of polybutylene terephthalate and composition, applied in the field of polybutylene terephthalate composition and its preparation, can solve the problem of low impact strength, low molecular chain flexibility, high molecular rigidity, etc. problems, to achieve the effect of high melting point, excellent processing performance, and little impact on mechanical properties

Inactive Publication Date: 2020-06-16
GUANGDONG ALDEX NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

From the structural point of view, there are benzene rings and polar ester groups that are difficult to move in the repeating structural unit of PBT. Due to the formation of a conjugated system between the benzene ring and the ester group, the molecule is more rigid and the molecular chain is more flexible. Low, so that the notched impact strength of PBT is low

Method used

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  • Polybutylene terephthalate composition and preparation method thereof
  • Polybutylene terephthalate composition and preparation method thereof
  • Polybutylene terephthalate composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] A polybutylene terephthalate composition of the present embodiment is prepared from the following raw materials in parts by weight:

[0087] 60 parts of polybutylene terephthalate A resin,

[0088] 20 parts of polybutylene terephthalate B resin,

[0089] 20 parts of ethylene-octene copolymer grafted glycidyl methacrylate,

[0090] The sum of the parts by weight of polybutylene terephthalate A resin, polybutylene terephthalate B resin and ethylene-octene copolymer grafted glycidyl methacrylate is 100 parts,

[0091]

[0092] The preparation method of above-mentioned polybutylene terephthalate composition, comprises the following steps:

[0093] (1) After placing the polybutylene terephthalate A resin and the polybutylene terephthalate B resin at a temperature of 90° C. for 8 hours, and then cooling, the cooled polybutylene terephthalate Butylene dicarboxylate A resin and polybutylene terephthalate B resin and the ethylene-octene copolymer grafted with glycidyl meth...

Embodiment 2

[0098] A polybutylene terephthalate composition of the present embodiment is prepared from the following raw materials in parts by weight:

[0099] 93 parts of polybutylene terephthalate A resin,

[0100] 5 parts of polybutylene terephthalate B resin,

[0101] 2 parts of ethylene-octene copolymer grafted glycidyl methacrylate,

[0102] The sum of the parts by weight of polybutylene terephthalate A resin, polybutylene terephthalate B resin and ethylene-octene copolymer grafted glycidyl methacrylate is 100 parts,

[0103]

[0104] The preparation method of above-mentioned polybutylene terephthalate composition, comprises the following steps:

[0105] (1) After placing the polybutylene terephthalate A resin and the polybutylene terephthalate B resin at a temperature of 120° C. for 4 hours, and then cooling, the cooled polybutylene terephthalate Butylene dicarboxylate A resin and polybutylene terephthalate B resin and the ethylene-octene copolymer grafted with glycidyl metha...

Embodiment 3

[0110] A polybutylene terephthalate composition of the present embodiment is prepared from the following raw materials in parts by weight:

[0111] 68 parts of polybutylene terephthalate A resin,

[0112] 16 parts of polybutylene terephthalate B resin,

[0113] Ethylene-octene copolymer grafted glycidyl methacrylate 16 parts,

[0114] The sum of the parts by weight of polybutylene terephthalate A resin, polybutylene terephthalate B resin and ethylene-octene copolymer grafted glycidyl methacrylate is 100 parts,

[0115]

[0116]

[0117] The preparation method of above-mentioned polybutylene terephthalate composition, comprises the following steps:

[0118] (1) After placing the polybutylene terephthalate A resin and the polybutylene terephthalate B resin at a temperature of 100° C. for 6 hours, then cooling, the cooled polybutylene terephthalate Butylene dicarboxylate A resin and polybutylene terephthalate B resin and the ethylene-octene copolymer grafted with glycidy...

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Abstract

The invention relates to a polybutylene terephthalate composition and a preparation method thereof. The polybutylene terephthalate composition is prepared from polybutylene terephthalate A resin, polybutylene terephthalate B resin, ethylene-octene copolymer grafted glycidyl methacrylate, hollow glass beads, polyhedral oligomeric silsesquioxane polymer, a titanate coupling agent, polytetrafluoroethylene resin, hyperbranched polyester polymer, erucyl amide, N,N'-bis(2,2,6,6-tetramethyl)4-piperidyl)-1,3-benzenedicarboxamide and bis(2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphate. The composition has excellent mechanical properties, processability and low dielectric constant, and can be applied to shells, cladding and protective materials and the like of 5G base stations, micro base station systems, data communication terminals, antennas and radio frequency modules.

Description

technical field [0001] The invention relates to the field of materials, in particular to a polybutylene terephthalate composition and a preparation method thereof. Background technique [0002] Dielectric materials, also known as dielectrics, are electrical insulating materials. According to performance, there are high dielectric materials and low dielectric materials. For low dielectric materials, with the rapid development of electronic information technology, electronic products are developing in the direction of lightweight, high performance and multifunctionality, and it is increasingly necessary to develop low dielectric constant ( D. k <3) Materials. At the same time, with the advent of the 5G era, the requirements for the transmission speed and loss of electronic signals are higher than those of 4G products. Usually, 4G products only require the dielectric constant of resin materials to be less than 3.7 (1GHz), while 5G products require The dielectric constant...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L67/02C08L51/06C08L83/06C08L27/18C08L67/00C08K13/04C08K7/28C08K5/20C08K5/3435C08K5/10C08K5/527
CPCC08L67/02C08L2205/08C08L2205/025C08L2205/035C08L51/06C08L83/06C08L27/18C08L67/00C08K13/04C08K7/28C08K5/20C08K5/3435C08K5/10C08K5/527
Inventor 王忠强卢健体冯刚韩春春
Owner GUANGDONG ALDEX NEW MATERIAL CO LTD
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