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Ultra-precision machining method of thin-wall complex structure monocrystal diamond inertial navigation device

A single crystal diamond, ultra-precision machining technology, used in metal processing equipment, manufacturing tools, laser welding equipment, etc., can solve the problems of low guidance accuracy and poor surface quality, and achieve improved guidance accuracy, rapid prototyping, and smoothness. Effect

Active Publication Date: 2020-06-19
DALIAN UNIV OF TECH
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Problems solved by technology

[0004] The present invention proposes the use of single crystal diamond instead of silicon and quartz materials for inertial navigation devices, and combines chemical mechanical polishing with picosecond and femtosecond laser composite processing to improve the problems of poor surface quality and low guidance precision of traditional inertial navigation devices

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  • Ultra-precision machining method of thin-wall complex structure monocrystal diamond inertial navigation device

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Embodiment Construction

[0016] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0017] like figure 1 As shown, an ultra-precision machining method for a single-crystal diamond inertial navigation device with a thin-walled complex structure includes the following steps:

[0018] Step 1, use double-sided polishing machine 1 to carry out double-sided polishing to single crystal diamond inertial navigation device 2 (be blank at this moment), during polishing, drop polishing liquid A3; 5μm, zirconia abrasive with a content of 95g / L, sodium persulfate with a content of 55g / L, ursolic acid with a content of 85g / L, and deionized water for the rest;

[0019] Step 2, using the five-axis linkage picosecond laser 4 to etch the morphology structure 2-1 of the inertial navigation device 2 on the polished single crystal diamond inertial navigation device 2 substrate, and further modifying the shape by the femtosecond laser 4; ...

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Abstract

The invention belongs to the field of ultra-precision machining, and particularly relates to an ultra-precision machining method of a thin-wall complex structure monocrystal diamond inertial navigation device. The method comprises the following steps of (1) double-sided polishing of monocrystal diamond, (2) five-axis linkage picosecond and femtosecond laser composite machining of morphology and structure of the inertial navigation device, and (3) whole immersion of the inertial navigation device in a polishing solution for chemical mechanical polishing. According to the method, firstly, double-sided polishing is conducted to obtain a high-precision device substrate; secondly, picosecond and femtosecond laser composite etching is conducted to realize high-precision and high-efficiency machining on a complex structure of the device; and finally, whole chemical mechanical polishing can be conducted on the etched monocrystal diamond inertial navigation device by combining an ultrasonic, heating and electromagnetic composite energy field and the like to complete ultra-precision machining on a workpiece. According to the composite machining mode, the problems that a traditional silicon and quartz inertial navigation device is low in performance guidance precision, a monocrystal diamond complex structure device is difficult to machine, a damage layer of the machining surface is large,and the overall quality is poor are solved.

Description

technical field [0001] The invention belongs to the field of ultra-precision machining, and in particular relates to an ultra-precision machining method for a single-crystal diamond inertial navigation device with a thin-wall complex structure. Background technique [0002] High-performance inertial navigation devices are not affected by weather and electromagnetic interference, and can be used without GPS navigation. They are widely used in aviation, aerospace, navigation, deep-sea exploration, military and other fields. They are international research hotspots and are also a major national demand. . The current inertial navigation devices are mainly made of silicon and quartz. Silicon inertial navigation devices have low precision, and the international guidance accuracy is 1°; cannot be used on high-performance devices. Single-crystal diamond inertial navigation devices have not been reported at home and abroad, so it is of great significance to develop high-precision, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00B24B37/00B23K26/362
CPCB23K26/362B24B1/00B24B37/00
Inventor 张振宇廖龙兴刘杰谢文祥
Owner DALIAN UNIV OF TECH
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