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Two-dimensional material transferring and assembling system and method

A technology of two-dimensional materials and assembly systems, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of complex relationship between components, low degree of freedom of mechanical operation, high cost, etc., to achieve optimized structure and low construction cost , the effect of high integration

Pending Publication Date: 2020-06-19
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Overcome the shortcomings of the existing high-precision two-dimensional material transfer and assembly system in the construction process of complex component coordination, low degree of freedom in mechanical operation, and high cost; the system is mainly composed of three parts: the base substrate, the manual mechanical operating system, and the imaging observation system. The base substrate is composed of a 200mm×400mm ferromagnetic breadboard with a rubber shock absorber installed at the bottom, which provides a stable foundation for shock absorption during transfer and assembly; the mechanical operating system is composed of a XY+θ two-dimensional plane corner sample stage and a three-dimensional (XYZ) manual operation table, XY+θ two-dimensional plane corner sample table is used to place and adjust the substrate material and its position, three-dimensional (XYZ) manual operation table is used to precisely control the two-dimensional material sheet and the substrate material to be transferred Alignment, bonding and separation functions of the target area; the imaging observation system is mainly composed of a telephoto lens with biaxial lighting function, a 2.1 million pixel digital camera and its mechanical fixing adjustment device, providing a visual basis for the entire transfer assembly operation process

Method used

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  • Two-dimensional material transferring and assembling system and method
  • Two-dimensional material transferring and assembling system and method
  • Two-dimensional material transferring and assembling system and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Step 1, using a metal hard mask, in 285nm SiO 2 A metal electrode with chromium (5nm) / gold (30nm) symmetrical structure was prepared by thermal evaporation on the / Si surface, and the channel distance between the electrodes was 30 μm.

[0047] Step 2: Select an indium selenide bulk material with good crystal quality and bright surface, and use SPV 224 Nitto adhesive tape to stick an indium selenide sheet with a thickness of about 1-3 microns on the surface of the bulk indium selenide material. The Nitto tape with the indium selenide flakes is bonded and separated several times until the indium selenide flakes with a thickness of about 1-100 nanometers are densely distributed on the surface of the tape. When bonding and separating, in order to protect the flat surface of the indium selenide body material, the surface of the indium selenide should be in full contact with the surface of the tape during bonding. When separating, proceed slowly in one direction.

[0048] S...

Embodiment 2

[0055] Step 1. Using the mechanical peeling method described in Step 2 to Step 7 in Example 1 and its transfer operation, prepare a two-dimensional hexagonal boron nitride sheet with a uniform size of about 100 μm*200 μm in thickness, and then use the method mentioned in the present invention Two-dimensional material transfer assembly system, transfer it to 285nm SiO with special positioning pattern 2 / Si substrate surface, used as bottom hexagonal boron nitride.

[0056] Step 2. Repeat the operations from step 2 to step 7 in Example 1 to prepare a two-dimensional indium selenide sheet with a side length of about 50 μm and a uniform thickness in the shape of an equilateral triangle, and then use the two-dimensional material transfer assembly system mentioned in the present invention, It is transfer bonded to the bottom hexagonal boron nitride surface. When transferring, it should be ensured that the two-dimensional indium selenide sheet is completely attached to the surface o...

Embodiment 3

[0060] Step 1, using a metal hard mask, in 285nm SiO 2 / Si surface thermal evaporation prepares a chromium (5nm) / gold (30nm) symmetrical structure metal electrode, and the channel distance between the electrodes is 10 μm.

[0061] Step 2. Using the mechanical peeling method described in Step 2 to Step 7 in Example 1 and its transfer operation, prepare a hexagonal boron nitride sheet with a size of about 50 μm*130 μm and a uniform thickness, using the two-dimensional material mentioned in the present invention Transfer the assembly system, adjust the length direction of the hexagonal boron nitride to be the same as the direction of the electrode channel, and transfer it and completely fit it on the electrode channel.

[0062] Step 3. Repeat the operations from step 2 to step 7 in Example 1 to prepare a two-dimensional indium selenide sheet with a uniform thickness of about 50 μm*100 μm, and then use the two-dimensional material transfer assembly system mentioned in the present ...

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Abstract

The invention provides a two-dimensional material transferring and assembling system and method, and belongs to the field of optoelectronic devices. The system comprises a base substrate, an operatingsystem and imaging observation system. The operating system is composed of an XY + theta two-dimensional plane corner sample table and a three-dimensional (XYZ) manual operating table, the XY + thetatwo-dimensional plane corner sample table is used for placing and adjusting a substrate material and the position of the substrate material, and the three-dimensional (XYZ) manual operating table isused for accurately controlling alignment of a to-be-transferred two-dimensional material sheet and a substrate material target area. The imaging observation system is composed of a telephoto lens with a biaxial illumination function, a digital camera and a mechanical fixing and adjusting device of the digital camera. The Gel-pak WF-30-x4-6mil type dimethyl siloxane (PDMS) used in the system can meet the requirement that the part, adhered with the to-be-transferred two-dimensional material sheet, of the PDMS is in the suspended state (as shown in Figure 3), the limitation of the glass sheet inthe transferring and laminating process in the background art is eliminated, the full contact of PDMS and the surface of the substrate is easily realized, the whole transferring process is shortenedto 5 minutes, and the transferring and assembling efficiency is improved.

Description

technical field [0001] The invention belongs to the field of optoelectronic devices, and in particular relates to a two-dimensional material transfer assembly system and method. Background technique [0002] Two-dimensional materials represented by graphene and transition metal chalcogenides are of great significance to the renewal and revolution of next-generation electronic and optoelectronic devices due to their excellent electrical, optical and mechanical properties. Benefiting from the ideal surface without dangling bonds, the development and application of high-precision 2D material transfer assembly system has promoted great progress in 2D materials research. On the one hand, the two-dimensional material transfer assembly system can realize the construction and preparation of devices based on two-dimensional materials, and on the other hand, it can stack two-dimensional materials with different properties at the atomic level to meet the requirements of artificial band...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/34H01L29/24H01L29/267
CPCH01L29/24H01L29/267H01L29/66969
Inventor 赵清华王涛介万奇安德烈斯·卡斯泰拉诺斯·戈麦斯里卡多·夫里森达
Owner NORTHWESTERN POLYTECHNICAL UNIV
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