Graphene-based high-thermal-conductivity low-thermal-resistance heat conduction paste and preparation method thereof

A graphene, high thermal conductivity technology, applied in chemical instruments and methods, heat exchange materials, etc., can solve the problems of thermal conductivity and low thermal resistance of thermal paste, and achieve the effect of improving thermal conductivity, realizing rapid transfer, and increasing transfer speed.

Active Publication Date: 2020-07-10
WEIHAI JINFU XINNUO PRECISION PLASTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention mainly solves the technical problems of low thermal conductivity and thermal impedance of the existing thermal conductive paste, and provides a thermal conductive paste with high thermal conductivity and low thermal impedance and a preparation method thereof

Method used

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  • Graphene-based high-thermal-conductivity low-thermal-resistance heat conduction paste and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The weight ratio of silicon substrate, graphene, spherical alumina, flake boron nitride, graphite whisker, surfactant, viscosity regulator, dispersant, defoamer, and antioxidant is 50:10:3:2: 6:0.105:0.5:0.8:0.8:0.7.

[0027] In parts by weight, 10 parts of graphene, 3 parts of spherical alumina, 2 parts of flaky boron nitride and 6 parts of graphite whiskers are placed together in a three-dimensional mixing system for mixing at a speed of 80 rpm / min for 30 minutes. Then place the mixed compound heat-conducting powder in a reaction vessel equipped with a condensation device, add 50 parts of ethanol and 0.105 parts of surfactant, stir and heat at 80°C, react for 5 hours, and then wash with absolute ethanol Dry in an oven at 130°C for 3 hours to obtain the surface-modified compound thermally conductive filler, and then mix the surface-modified compound thermally conductive filler with 50 parts of silicon matrix, 0.5 part of viscosity modifier, 0.8 part of dispersant, 0.8 ...

Embodiment 2

[0034] In parts by weight, 12 parts of graphene, 5 parts of spherical alumina, 4 parts of flaky boron nitride and 7 parts of graphite whiskers are placed together in a three-dimensional mixing system for mixing at a speed of 120 rpm / min for 60 minutes. Place the mixed compound heat-conducting powder in a reaction vessel equipped with a condensing device, add 50 parts of ethanol solution and 0.14 parts of surfactant, stir and heat at 80°C, react for 5 hours, then wash with ethanol and set at 130 Dry in an oven at ℃ for 3 hours to obtain the surface-modified compound thermally conductive filler, and then combine the surface-modified compound thermally conductive filler with 50 parts of silicon substrate, 0.6 part of viscosity modifier, 0.9 part of The antioxidant was mixed and stirred evenly. After stirring evenly, vacuum defoaming at room temperature, the vacuum degree was 0.05MPa, and the duration was 30 minutes. Finally, the mixture was subjected to three-roller grinding for 2...

Embodiment 3

[0036] In parts by weight, 15 parts of graphene, 6 parts of spherical alumina, 5 parts of flaky boron nitride and 9 parts of graphite whiskers are placed together in a three-dimensional mixing system for mixing at a speed of 150 rpm / min for 90 minutes. Place the mixed compound heat-conducting powder in a reaction vessel equipped with a condensing device, add 50 parts of ethanol and 0.175 parts of surfactant, stir and heat at 80°C, react for 5 hours, then wash with absolute ethanol and place in the Dry in an oven at 130°C for 3 hours to obtain the surface-modified compound thermally conductive filler, then mix the surface-modified compound thermally conductive filler with 50 parts of silicon substrate, 0.7 part of viscosity modifier, 1.0 part of dispersant, 0.8 part Mix and stir evenly, after stirring evenly, vacuum defoaming at room temperature, vacuum degree 0.05MPa, time length is 30min, and finally the mixture is subjected to three-roller grinding for 20 minutes, and the gri...

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Abstract

The invention discloses graphene-based high-thermal-conductivity low-thermal-resistance heat conduction paste and a preparation method thereof. The graphene-based high-thermal-conductivity low-thermal-resistance heat conduction paste is prepared from the following materials through vacuum heating defoaming and grinding, and the material formula mainly comprises a silicon matrix, graphene, spherical alumina, flaky boron nitride, graphite whiskers, a surfactant, a viscosity modifier, a dispersant, a defoamer and an antioxidant. The graphene-based high-thermal-conductivity low-thermal-resistanceheat conduction paste has the advantages that after the heat-conducting fillers with different particle sizes and different shapes are added in the formula and subjected to surface modification treatment, effective stacking among the heat-conducting particles can be realized so that the problems of high impedance and low thermal conductivity of the traditional heat-conducting paste are solved, andthe high-thermal-conductivity low-thermal-resistance heat-conducting paste is prepared.

Description

technical field [0001] The invention relates to a thermal interface heat conduction material, in particular to a heat conduction paste with high heat conduction and low heat resistance and a preparation method thereof. Background technique [0002] In recent years, the rapid development of electronic technology, the miniaturization, high power and high integration of integrated circuits, and the continuous increase in the assembly density of electronic components have caused a sharp increase in the heat generated by electronic components per unit area. In order to reduce the heat generated by electronic components when they work Dissipate as soon as possible and adopt various heat dissipation methods, such as using heat pipes to dissipate heat, water-cooled auxiliary heat dissipation, etc. However, since the contact interface between the heat dissipation device and electronic components cannot achieve an ideal flat surface, air will exist in the gap between the two, increasin...

Claims

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Application Information

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IPC IPC(8): C08L83/08C08L1/28C08K13/06C08K9/06C08K3/04C08K7/18C08K7/00C08K3/38C08K7/06C09K5/14
CPCC08L83/08C09K5/14C08K2003/385C08K2201/003C08K2201/004C08K2201/001C08L1/286C08K13/06C08K9/06C08K3/042C08K7/18C08K7/00C08K3/38C08K7/06
Inventor成文俊李磊李利民
OwnerWEIHAI JINFU XINNUO PRECISION PLASTIC