A low flow resistance chip embedded array microfluidic radiator and its manufacturing method

Abstract

A low-resistance chip-embedded array micro-jet radiator and a manufacturing method thereof, using viscoelastic fluid as a medium, including a bonded and sealed chip substrate, a partition and a liquid supply bottom plate. There are several micro-grooves and micro-columns on the chip substrate; several jet micro-holes and return micro-holes are set on the partition; working fluid inlets, liquid separation areas, several liquid supply micro-channels, and several liquid return channels are set on the liquid supply bottom plate. Micro channel, liquid collection area and outlet of working fluid. The liquid distribution area is connected with the working medium inlet, the liquid supply microchannel is connected with the liquid separation area, the liquid return microchannel is connected with the liquid collection area, and the liquid collection area is connected with the working medium outlet. The chip-level embedded micro-jet heat sink of the present invention guides the cooling liquid directly to the chip substrate of the chip, which greatly reduces the heat conduction resistance from the heat source to the fluid; uses the micro-hole jet cooling structure to trigger elastic turbulence in the flow field, and realizes Microfluidic heat transfer is enhanced at low Reynolds numbers, thereby greatly reducing flow resistance and reducing pump power consumption.

Description

technical field [0001] The invention belongs to the field of heat dissipation of semiconductor chips, and relates to a high-efficiency heat dissipation technology suitable for ultra-high heat flux density chips, in particular to a chip-embedded array micro-jet radiator with low flow resistance and a manufacturing method thereof. Background technique [0002] With the rapid development of electronic information technology and micro-nano processing technology, the performance, frequency and integration of electronic chips continue to increase, but the size continues to decrease, which makes the heat flux of electronic chips increase rapidly. At present, the average heat flux density of RF power devices (such as GaN power devices) has exceeded 1kW / cm 2 , the local heat flux in the active area is more than 10 times the average value. How to quickly transfer the heat of the chip from the heating area to the environment, reduce the junction temperature of the chip, thereby improv...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a low-resistance chip-embedded array micro-jet radiator and its manufacturing method, which can solve the bottlenecks of traditional micro-jet heat exchange technology such as high flow resistance, large pressure drop and easy wear.

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