Solder strip for IBC photovoltaic module

Abstract

The invention aims at disclosing a solder strip for an IBC photovoltaic module. The solder strip comprises a base material and a coating covering the surface of the base material, wherein stress buffer grooves are formed in the base material and distributed in the length direction and the width direction of the base material. Compared with the prior art, the solder strip of the invention has the following characteristics that the coating is made of three materials of Sn, Bi and Pb, the melting point is 160-180 DEG C, low-temperature welding can be achieved, good tensile force is achieved, andthe problem that insulating slurry of an IBC battery is not resistant to high temperature is solved; the stress buffer groove is formed in the base material, and low-temperature welding is adopted, sothat the problem that the IBC battery is easy to crack due to stress concentration during welding can be effectively reduced; and a vacuum evaporation method is adopted to plate a coating, so that the film forming speed is high, the quality is high, the thickness can be accurately controlled, and the purpose of the invention is achieved.

Description

technical field [0001] The invention relates to a welding ribbon for a photovoltaic module, in particular to a welding ribbon for an IBC photovoltaic module. Background technique [0002] As a low-carbon renewable energy, the solar energy industry is gaining more and more attention worldwide. At present, the most important application of solar energy is photovoltaic power generation. [0003] Solar photovoltaic modules connect batteries in series through welding ribbons. The quality of welding ribbons directly affects the output efficiency and fragmentation rate of current in the production of photovoltaic modules, and also has a great impact on the cost and output power of photovoltaic modules. It is an important part of photovoltaic modules. The main reason for the breakage of crystalline silicon cells during the welding process is that the silicon chip will rapidly drop from 250°C to room temperature in a short period of time during welding. After cooling, under the acti...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a welding ribbon for IBC photovoltaic modules, which can buffer the stress after welding, reduce the fragmentation rate in the module preparation process, and solve the problem of the insulation paste of IBC batteries. High temperature resistance, the problem that it cannot be welded with conventional ribbon

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