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Manufacturing method of thick copper printed circuit board

A technology of printed circuit board and manufacturing method, which is applied in the directions of printed circuit manufacturing, printed circuit, and printed circuit secondary processing, etc., can solve the problem of long etching process, corrosion of thick copper sides of design lines, affecting product performance and quality, etc. problem, to improve the protection performance, avoid sundries from adhering to the surface of the circuit, and improve the service life.

Active Publication Date: 2020-07-31
JINGDEZHEN HONGYI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The etching link of this method has the following disadvantages: since the circuit board is printed with thick copper, the etching process is relatively long, and only the common etching method is used to coat the protective layer on the surface, which may cause the design circuit to be damaged due to the long etching time. Thick copper sides are corroded, affecting product performance and quality

Method used

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  • Manufacturing method of thick copper printed circuit board
  • Manufacturing method of thick copper printed circuit board
  • Manufacturing method of thick copper printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] A kind of manufacture method of thick copper printed circuit board, such as figure 1 As shown, the following steps are included in sequence:

[0071] S1: Size cutting; cut the raw material to the full size according to the set circuit size to obtain a large circuit board;

[0072] S2: drilling; drilling at the set position;

[0073] S3: Engraving; use a milling machine or a laser engraving machine to carve out the edge area of ​​the set circuit according to the set circuit to form a groove, so that the set circuit is initially formed and separated from the surrounding thick copper area by the engraved groove Come;

[0074] S4: Make a silk screen; make a screen mask based on the pre-designed circuit diagram based on the size engraved in step S3, and use wax or impermeable material to cover the screen, and then put the screen mask in S3 on a large circuit board;

[0075] S5: Corrosion; apply a protective agent that will not be corroded on the screen oil, so that the p...

Embodiment 2

[0089] A kind of manufacture method of thick copper printed circuit board, such as figure 2 As shown, the following steps are included in sequence:

[0090] S1: Size cutting; cut the raw material to the full size according to the set circuit size to obtain a large circuit board;

[0091] S2: Grinding once; Grinding the large circuit board to make the surface of the circuit board smooth;

[0092] S3: drilling; drilling at the set position;

[0093] S4: Engraving; use a milling machine or laser engraving machine to carve out the edge area of ​​the set circuit according to the set circuit to form a groove, so that the set circuit is initially formed and separated from the surrounding thick copper area by the engraved groove Come;

[0094] S5: Make a silk screen; make a screen mask based on the pre-designed circuit diagram based on the size engraved in step S3, and use wax or impermeable material to cover the screen, and then put the screen mask in S3 on a large circuit board...

Embodiment 3

[0108] A kind of manufacture method of thick copper printed circuit board, such as figure 2 As shown, the following steps are included in sequence:

[0109] S1: Size cutting; cut the raw material to the full size according to the set circuit size to obtain a large circuit board;

[0110] S2: Grinding once; Grinding the large circuit board to make the surface of the circuit board smooth;

[0111] S3: drilling; drilling at the set position;

[0112] S4: Engraving; use a milling machine or laser engraving machine to carve out the edge area of ​​the set circuit according to the set circuit to form a groove, so that the set circuit is initially formed and separated from the surrounding thick copper area by the engraved groove Come;

[0113] S5: Make a silk screen; make a screen mask based on the pre-designed circuit diagram based on the size engraved in step S3, and use wax or impermeable material to cover the screen, and then put the screen mask in S3 on a large circuit board...

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Abstract

The invention discloses a manufacturing method of a thick copper printed circuit board, and relates to the field of circuit board manufacturing. For improving manufacturing quality, the method specifically comprises the following steps: size cutting; cutting the raw material into a full size according to a set circuit size to obtain a large circuit board; performing drilling; drilling at a set position; engraving and printing; a milling machine or a laser engraving machine is used for engraving the edge area of the set circuit according to the set circuit to form a groove, so that the set circuit is preliminarily formed and separated from the surrounding thick copper area through the engraved groove; manufacturing a silk screen; and, making a pre-designed circuit diagram into the silk screen mask based on the size engraved in the step S3. Based on the thick copper material, the groove is engraved in the engraving step, and then the protective agent treatment is carried out, so that theside edge of the circuit board circuit can be fully protected, and the situation that the thick copper side edge of the designed circuit is corroded due to long etching time, and the performance andquality of the product are affected is effectively avoided.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for producing a thick copper printed circuit board. Background technique [0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. Its development has a history of more than 100 years; its design is mainly layout design; the main advantage of using circuit boards is that it greatly reduces the errors of wiring and assembly, improves the level of automation and production labor rate; the production method of printed circuit boards There are many kinds, and the most suitable processing and manufacturing process should be selected based on the different raw materials of the circuit board. [0003] After searching, the Chinese patent application number is CN201810172937.5, which discloses a method of manufacturing thick copper printed circuit boards, which is low in cost, can av...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28H05K3/22H05K3/26
CPCH05K3/282H05K3/22H05K3/26H05K2203/0221H05K2203/0228H05K2203/025
Inventor 彭金田
Owner JINGDEZHEN HONGYI ELECTRONICS TECH CO LTD
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