Single nanowire and preparation method thereof, hydrogen sensor and micro-nano electromechanical equipment
A nanowire, single-wire technology, applied in the field of hydrogen sensor and micro-nano electromechanical equipment, single nanowire, can solve the problems of device failure and damage, the overall stability of the device needs to be improved, the size of the Pd film is large, etc. Phase transition reaction, solving hydrogen embrittlement effect, device firm and stable effect
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[0063] like figure 1 As shown, the present invention provides a method for preparing the single nanowire, comprising:
[0064] S101, in SiO 2 / Si substrates are fabricated with Au electrodes using photolithography, sputtering or Lift-off basic MEMS processes.
[0065] S102, using electron beam exposure technology, sputtering or Lift-off basic MEMS process to fabricate and prepare Pd nanowires on the substrate with gold electrodes.
[0066] The step S101 Au electrode fabrication method includes:
[0067] (1) After cleaning the SiO 2 / Si substrate was spin-coated with photoresist, and then the substrate was placed on a heating table for baking; the baking temperature was 100° C. and the baking time was 3 min.
[0068] (2) Place the substrate on the stage of the lithography machine, cover it with a special metal mask, and expose it twice with ultraviolet light; the two exposure times are 5s and 10s respectively, and bake at 100°C after the first exposure. Bake for 2 minutes...
Embodiment
[0080] Step 1: Au electrode preparation
[0081] a. After cleaning the SiO 2 / Si substrate is spin-coated with photoresist (AZ5214), and then the substrate is placed on a heating table for baking; in the present invention, the baking temperature is set to 100° C. and the baking time is 3 minutes.
[0082] b. Place the substrate on the stage of the lithography machine, cover it with a special metal mask, and expose it twice with ultraviolet light; set the two exposure times to be 5s and 10s respectively, and 100 after the first exposure. Bake at ℃ for 2 min.
[0083] c. "Rinse" the exposed substrate in an appropriate amount of developer, and then bake it again; set the development time to 40s, the baking temperature to 100°C, and the time to 30min.
[0084] d, utilize the magnetron sputtering apparatus to deposit metal Ti and Au respectively on the above-mentioned substrate surface, then place in acetone solution ultrasonic cleaning to remove the photoresist, and the desired ...
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